Electronics Forum | Sat Aug 21 12:38:09 EDT 1999 | Earl Moon
| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototypi
Electronics Forum | Mon Aug 16 04:38:18 EDT 1999 | Earl Moon
| Hello | I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce
Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg
Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part
Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef
Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad
Electronics Forum | Tue Mar 24 17:14:44 EDT 2009 | bas251
In my experience, before my current employment, I have personally seen damage from the water soluable fluxes left under a BGA. In consideration, I have not seen it from an assembly process where the boards are cleaned thoughly, but I have seen it dur
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Thu Jan 16 04:02:18 EST 2003 | johnw
The IPC 610 actally conflict's with 7095 which give's a better indication of what's acceptable. I believe that IPC are reviewing both. Motorola did a bunch of work before basically showing that void's aren't that bad up to a certain size, I think pro
Electronics Forum | Fri Mar 19 08:51:57 EST 1999 | Justin Medernach
| | | After rmoving a BGA (plastic)to correct unexplained shorts | | | I installed another BGA using flux only. | | | Checking on an X Ray machine and found two shorts. | | | | | | can anyone give a good explenation ? | | | | | | Thanks | | | | |
Electronics Forum | Tue Mar 13 16:05:30 EST 2001 | rob_thomas
Hi, can you definitely attribute the 30%yield to poor bga soldering? What is your high flyer defect encountered on the failed boards.Is this ICT ,flying probe ,functional test yield? Can you determine a defect pattern? Did your subcontractor provided
Electronics Forum | Mon Mar 15 16:07:32 EST 1999 | Earl Moon
| | After rmoving a BGA (plastic)to correct unexplained shorts | | I installed another BGA using flux only. | | Checking on an X Ray machine and found two shorts. | | | | can anyone give a good explenation ? | | | | Thanks | | | | Ron | | | Ron,
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