Electronics Forum | Fri Sep 05 09:15:36 EDT 2014 | rgduval
Hi, Edri, It's not uncommon for PCB fab houses to change pad sizes like that, due to design constraints....however, it always aggravates me when they do it without checking with me first. In my mind, that's the first sign of potential bad issues wi
Electronics Forum | Sat Sep 30 11:59:30 EDT 2000 | jarnopy
Hi! What kind is perfect smt line? It's difficult question. First you must know what kind your production is. Do you have a serial production or do you have a lot of proto series? If you have only few different pcb then you must get placemant machine
Electronics Forum | Thu Apr 27 21:04:33 EDT 2000 | Dave F
Ron: Good news: Nicolet makes excellent machines. Bad news: I�m unaware of a machine with the capabilities you seek. * X-ray machines lack of resolution needed in relation to the crack geometries encountered within a high density single material.
Electronics Forum | Wed Jan 05 11:43:11 EST 2000 | Dave F
Yins, In low volume applications, using X-ray for BGA mounting process control is: 1 Very expensive approach, as you've stated. 2 Requires beaucoup operator training and interpretation of results. Which is double bad, because of the intermittent n
Electronics Forum | Wed Sep 29 07:28:04 EDT 1999 | Wolfgang Busko
3�C/min) or maximum temperature (~240-250�C)." For the correct handling of moisture sensitive devices and prebaking advices see IPC-SM-786A or newer publikations. I encountered the following: A tray of sample BGAs was send to me proper packed and se
Electronics Forum | Thu Jan 21 09:27:33 EST 1999 | Earl Moon
Hello, I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all the re
Electronics Forum | Wed Jun 11 09:58:35 EDT 2003 | swagner
Solder fillet inspection is something that I would avoid like SARS, solder joints are like a snowflake no two are the same, henceforth unrepeatability. The only time I would look into this would be for uBGA or flipchip on an audit basis utilizing X-
Electronics Forum | Mon Jul 28 08:54:52 EDT 2003 | davef
You are 100% correctomundo about ENIG. When it's good it's good, BUT when it's bad, you just want something else. You know you have black pad, when you see parts falling from the board. First, there is not perfect solderability protection. Second
Electronics Forum | Wed Jan 04 15:10:27 EST 2006 | grantp
Hi, That's the main problem. I quickly checked out the motorola document, and thanks for posting that, but the main reason for failure seems to be that the ball is not touching the solder pad. I wonder what kind of ball size tolerance they had on th
Electronics Forum | Thu Dec 08 08:22:58 EST 2005 | grantp
Hi, How fine pitch are you going? What kind of stencil printer are you using? We had a manual stencil printer and needed to print 1-mm pitch BGA and needed to go to laster cut and electro polish at 4 thou to get good paste release. We also went 1:1
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