Full Site - : bad bga (Page 20 of 27)

Re: all powerfull UP78..or is it..?

Electronics Forum | Fri Apr 30 15:24:12 EDT 1999 | Kevin Hussey

| Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | My question's are really : | how is the printabilit

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: Wells-CTI BGA Socket Alignment Issue?

Electronics Forum | Tue Jan 19 20:47:35 EST 1999 | Steve Gregory

| Recently, someone in the SMTNET forum had installed a Wells-CTI Z-Lok socket and found that it was one row off from the board layout pads. Was the problem due to a layout error or was the datasheet incorrect? Dave ol' pal...dat wuz me...

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F

Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,

Multitroniks, Quad System and Tyco Info

Electronics Forum | Wed Aug 01 09:36:17 EDT 2001 | Pete Barton

Jay, > > I agree with your assement and Chips on > the Quads. I once worked at a shop that had Quads > and DynaPerts(at the time) The perts were > slower(TIME) and required(EFFORT/PEOPLE) more > MAINTENANCE(more effort more people and more > re

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 11:14:44 EDT 2001 | Cemal Basaran

Dave; Thanks for responsding so fast. here are my answers. 1-WOW!!! How do people get these cool toys? I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the

Re: solder land analisys

Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon

| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec

Re: Approach To Contamination Testing Of PCBs

Electronics Forum | Sat May 16 19:31:27 EDT 1998 | Graham Naisbitt

Gentlemen, Please consider that ionic testing is designed only for detecting ionic contaminants. Yes there are instances of non-ionic contaminants that cause premature circuit failure. However, more importantly the prevailing specs are less than adeq

BGA void removal

Electronics Forum | Sun Oct 20 12:49:11 EDT 2002 | johnw

Dave, I've had a few intersting conversations with Dr Lee, now there's a guy who know's stuff, but as it turn's out even he doesn't have all the answers on why things void. Many of his papers point towards oxides or contamination on the ball, so age


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