Hanwha HM520 Pick and Place Machine Hanwha HM520 Chip Mounter Patch speed: 80,000 CPH size:890x2370x1930mm weight:1605KG Product description: Hanwha HM520 modular pick and place machine, it's Hanwha's first modular chip mounter, 890MM length.Patch
Mechatronika's M50 Pick and Place System is a versatile automatic machine for placing SMD components from 0402 to 35 x 35 mm. Matured, high quality rigid construction, ease to program and excellent price to performance ratio make M50 perfectly suit
Electronics Forum | Tue Apr 27 08:14:59 EDT 2004 | iqbal
Is anybody doing BGA soldering water clean solder. If yes how you are ensure cleaness. We have boards with Four BGA and 2000 chip and ICs.We are processing with no clean solder but we are getting bad wetting so now we are planning to switch to water
Electronics Forum | Fri Feb 23 08:26:12 EST 2007 | realchunks
No, you can simply replace the bad BGA with a new one. If this is a one of kind BGA and you must use it, then you need to get it reballed.
Used SMT Equipment | Pick and Place/Feeders
Manncorp MC385V2-V Pick and Place Vintage: 2014 Details: Windows 7 Professional Operating System Dual Placement Heads Placement Rate (IPC-9850): 5,500 CPH
Used SMT Equipment | Pick and Place/Feeders
Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2018-10-18 10:02:00.0
How does PCB X-Ray Inspection Work?
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: JUKI Part Name: Hard Disk Part Number: 40047579 Machine: FX3 Machine Condition: New Origin: China 40047579 FX3 HDD ASM JUKI Hard Disk with software For JUKI FX3 Machine Detail Information: 1, Part Name: H
Parts & Supplies | Pick and Place/Feeders
> FUJINTAI TECHNOLOGY CO.,LTD JUKI E9572729CA0 LA (L) CABLE ASM. www.fujintai.com JUKI E95737290A0 MTC I/F(L) CABLE ASM. FUJINTAI TECHNOLOGY CO.,LTD JUKI E95738550A0 DISPESE SV ASM www.fujintai.com JUKI E95747210A0 BAD MARK SENSOR CABLE ASM. FUJI
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Head-in-pillow One of the most commonly looked for defects is Head-In-Pillow or HIP. Often seen in Ball Grid Array (BGA) device connections post reflow, where the BGA ball and solder paste on the PCB pad do not form a cohesive joint
Lewis & Clark | https://www.lewis-clark.com/
: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability Dual-Vision Alignment System Integral Vacuum Max Placement Area: 13.8″ x 17.1
