Electronics Forum | Thu Oct 07 20:34:48 EDT 1999 | Tony Huang
Hi, Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! Thanks, Tony
Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
Electronics Forum | Thu Nov 09 23:27:53 EST 2000 | Craig
We are considering using gold plating on our fine pitch pcbs (as oppossed to HASL). We have heard of long term solder reliability problems with joint imbrittlment how bad is this and does it apply for all of the different plating processes the same?
Electronics Forum | Fri Apr 13 22:38:19 EDT 2001 | edylc
Hi , Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape....?? You mean , the adhesive properties of the kapton tape will cause the gold plating on the gold finger to be somehow peel of
Electronics Forum | Fri Nov 10 17:44:48 EST 2000 | Dave F
In response to your questions: Is the embrittlement from excess gold in lead / tin solder connections bad? It can be vereeee bad. Does it affect all plating processes the same? Give us a break and read the SMTnet Archives, for instance: BGA prob
Electronics Forum | Mon Jul 31 10:51:11 EDT 2006 | Chunks
OK so you're stuck with gold. Not all that bad unless you're paying for it. Gold is very flat compared to HASL, so you should have no problems printing. This should lead to good placement as well. But after oven you mat have a big contrast betwee
Electronics Forum | Wed Jan 09 21:19:49 EST 2002 | davef
When I said "In this area, there is no difference between your experience in ceramic substrates and PTFE substrates." I was referring to the area we were discussing ... gold plating. I am sorry if you thought I ment than the wire bonding process wa
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements
I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about
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