Electronics Forum | Fri Oct 07 08:48:45 EDT 2016 | davef
Two things ... A friend in the contract coating business said: "... the board is not being baked out long enough, 30 min is certainly not long enough depending on how many layers this board is, as the vacuum (from the parylene process) is pulling t
Electronics Forum | Wed Oct 05 04:32:49 EDT 2016 | piyakorn
Rinse IPA 5 Min --> Treathment/soak IPA50%+SILENT50% 5Min --> Baking 60C/30Min --> Parylene coating (around 8Hr in chamber) --> Found defect spot. We have simulated and ensure board drying before parylene that still have spots. Need help - Thank y
Electronics Forum | Mon Dec 31 05:14:58 EST 2001 | ronih
Hello, Are there any rules for PCB drying (baking) before assembly; Date code criteria, finish process on PCB, storage conditions.. ect. I know some assemblers that are baking all PCB (not ENTEK!) as default before assembly, is it realy nessesary? i
Electronics Forum | Tue Sep 21 16:09:08 EDT 2004 | davef
Q1: What is "enough surface free energy"? A1: Look here for background: http://www.azom.com/details.asp?ArticleID=1575 Q2: How do I determine surface free energy? A2: We look at it a relative term. For instance, a semi matte finish on solder mask
Electronics Forum | Tue Aug 15 17:00:52 EDT 2006 | Board House
Bake your solder mask and then solder coat. If you are going to put an immersion finish like Osp, gold, tin or silver you would have to do a Micro etch to clean the copper prior to placing the surface finish. Regards, Board House
Electronics Forum | Thu Apr 14 17:24:06 EDT 2022 | cbart
depends on board finish and PCB substrate materials. If you were using OSP or silver finished bare boards the time to process is less than an ENIG or HASL finished. certain substrate material absorb more moisture than others or at a quicker rate. so
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Fri Jan 21 13:27:38 EST 2011 | mosborne1
Try baking your boards first to remove the moisture. Moisture and boards that have not been drilled properly will cause pin hole or blow holes in PTH. Also take a look the surface of the pads before printing. You maybe contaminating the surfaces of t
Electronics Forum | Tue Jul 06 08:04:01 EDT 2004 | ANDREW
Thanks Dave, The surface finish is ENIG.Is it ok not to bake even though the HIC has changed color? What is the shelf life for ENIG boards?
Electronics Forum | Mon Dec 31 09:00:06 EST 2001 | davef
Baking before assembly does nothing good. It: * Increases costs. * Adds steps to the process and makes scheduling more cumbersome. * Increases the amount corrosion on solderable surfaces. We used to bake to remove the moisture from boards that caus
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