Full Site - : bake before surface finish (Page 13 of 26)

To use a mini stencil, or not to use a mini stencil.

Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto

We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection

What caused this reflow issue?

Electronics Forum | Thu Apr 17 10:44:24 EDT 2008 | rculpepp

I'd suspect contamination also, possibly from the board supplier. Sr. Tech's post mentioned what looks like a blister on the board, in the upper right of the Q19 photo. This could very well be a contaminate from the PWB fab shop. I've seen similar pr

Re: Popcorn @ reflow

Electronics Forum | Thu May 20 19:11:48 EDT 1999 | Earl Moon

| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | Deo

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef

Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Thu May 28 07:25:58 EDT 1998 | Earl Moon

| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Thu May 28 05:43:33 EDT 1998 | Earl Moon

| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p

Re: Suspected Pink Ring

Electronics Forum | Wed Jul 28 20:14:22 EDT 1999 | Dave F

| While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That would

Silver Emerge

Electronics Forum | Thu Jun 14 21:14:04 EDT 2001 | davef

There�s tons of stuff on-line. Do a net search on "immersion silver". Examples are: * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROCEEDING_ID=571 * http://www.enthone-omi.com/articles/FinalFinishesT1.pdf * http://www.epa.gov/opptintr

What is this?

Electronics Forum | Wed Nov 06 12:56:10 EST 2002 | slthomas

What I'm seeing is an occasional pattern of tear drop shaped features in a sea of nice shiny solder. The little islands don't really have any relief.....it's more of a surface finish feature than a 3-dimensional feature. The wetting angles are good,

Conformal Coat (Urethane) & bubbles

Electronics Forum | Tue Jan 24 19:00:15 EST 2006 | MikeF

Graham Naisbitt is definitely an expert on conformal coating, he has posted answers here for years. Check your material to see what the cure mechanism is. Most urethanes need moisture from the air to cure, the higher the relative humidity the faste


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