Electronics Forum | Tue Sep 21 11:39:41 EDT 2004 | pabloquintana
Conformal coat a bare board to determine if there > is there is enough surface free energy from your > solder mask to prevent dewetting. Sorry for my ignorance, but what is "enough surface free energy"? How do I determine that? >* Bake a board
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Tue Jul 25 16:08:52 EDT 2017 | dontfeedphils
I'm currently working on bringing a manual coating process/workcenter online and my QA team is giving me some grief. For background, we're using Humiseal 1B31 thinned with thinner 521, mixed at 1:1 by volume. Spraying through a Binks HVLP with 10 P
Electronics Forum | Fri Sep 24 10:57:18 EDT 1999 | Earl Moon
| Hi Folks: | | We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. | | The bridging is happening after coming out of reflow...one la
Electronics Forum | Tue Jan 19 11:12:41 EST 1999 | Dave F
| | | | | Folk's, | | | | | | | | | | I'm looking for information of how long you cna store a gold finish PCB before building it. I know there are problems with the gold disappearing into the underlying nickle over time / temperature etc but exactly
Electronics Forum | Wed Sep 08 21:32:46 EDT 1999 | Jason Nipper
| | | | | | Hello: | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting
Electronics Forum | Sun Sep 12 10:51:04 EDT 1999 | K.T
| | | | | | | Hello: | | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before put
Electronics Forum | Fri Feb 24 13:04:17 EST 2006 | patrickbruneel
Hi All, The change over to lead-free is as easy or as difficult as you want to make it The big problem I see with this lead-free transition is that there is no benchmark of acceptability and no defect data (yet) related to visual appearance of a sol
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