Electronics Forum | Mon Feb 09 09:00:17 EST 2015 | jax
Outside the MSD issues stated already (and I cannot provide a exact time not knowing multiple factors like Humidity levels, temps, exposure times, etc...) OSP might be the very worst finish to use in this scenario of side 1 / store on a shelf / side
Electronics Forum | Fri Oct 19 00:37:43 EDT 2001 | ianchan
Hi, my guys did such solder paste deposits on PCB bareboards before, (before my physical join with my current company), approximately 2-3 years ago, for a small Lot run. What the PCB supplier did was to apply "block" shaped Sn/Pb paste alloy onto t
Electronics Forum | Wed Jul 09 19:05:06 EDT 2003 | randywomack
LOZ. Under-cured or out-of-spec(sloppily) applied resist is realistic. What other physics: Shiny resist surface is more prone to balls then matte finish. How about an operator eating fish & chips before handling the boards. Don't laugh... ... saw th
Electronics Forum | Tue Apr 26 07:56:12 EDT 2016 | joelperez
Hello SMTnet team, I have read before that silver content on solder joints is ok at around 2% total silver content. Does anyone has experience using SN62/PB36/AG2 BGAs on hard gold (10 micro inches) PCB surface finish? Any drawbacks? Thanks Joel
Electronics Forum | Fri Jun 27 22:33:16 EDT 2003 | Ben
HI, I'm doing a dye penetrant and peel test of non-function BGA solder joints to locate the fracture surface. After applying dye, I found the dye ink just accumulate at the solder mask edge and spread everywhere after I peeled off the package. THis i
Electronics Forum | Mon Aug 28 17:04:52 EDT 2006 | Board House
ImSn - Immersion Tin - Not Recomended- short shelf life ImAg - Immersion Silver - Prefered Surface finsh by most Board houses, Best reworkablility, 12 moth self life, ENIG - Electroless Nickel Immersion Gold - Second Choice for Board Shops, 12 -
Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
Electronics Forum | Wed Aug 14 16:44:54 EDT 2002 | dragonslayr
What is the surface finish? HASL, Entek? what? If HASL, ask your fab supplier for recommendations, maybe even rerun the boards through the HASL process. The fab house would have to strip off the old coating and reapply. Just a thought, depends on y
Electronics Forum | Thu Aug 19 19:04:55 EDT 1999 | Brian Wycoff
| | Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use
Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan
I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl
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