Electronics Forum | Thu Oct 01 20:11:31 EDT 1998 | Wayne Bracy
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
Electronics Forum | Mon Dec 07 12:33:03 EST 1998 | Jeff Sanchez
| There are significant differences in a properly designed dryer vs. an Oven. Ovens mearly bake the moisture from assemblies. The high humidity of a drying environment was not considered when most reflow ovens were designed. Dryers are designed wit
Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Sun Mar 21 21:27:26 EST 2004 | laxman
We are also facing this issue. Normally we are baking all MSD 24 HRS @125�C. This may not be a standard practice. I have read that depending on the Package thickness Baking time and temperature varies apart from the storage conditions of the IC. IS t
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Wed Jan 23 22:49:38 EST 2013 | ercdave1
Asking the great minds with experience for some advise. I am looking to go from placing components with a low quality machine to a low cost production machine. I am tired of inspecting after placement and spending hours aligning the parts with twezer
Electronics Forum | Wed Nov 29 01:46:10 EST 2006 | hanocete
Hi! to all, Here in our company, we sometimes received BGAs and ICs that were packed poorly(not sealed), and no MSL level written to it from our suppliers, now we subject the material for baking before using it. We use J-STD-033B table 4-1 as our cr
Electronics Forum | Fri Apr 15 14:25:57 EDT 2011 | ryanr
We've received in a batch of ICs (Xilinx FPGAs) from a customer on consignment that are having wetting issues. I believe the chips are contaminated. We also know that the chips were bought from a broker. Is there a method to remove the contamination
Electronics Forum | Mon Mar 05 11:51:21 EST 2007 | muse95
Join the "big issue" club. We were just reading the "fine print" (no, it wasn't fine print...) in J-STD-033, and noticed that we overlooked the requirement that when baking at 40C (or any temp below 100C) the humidity in the oven must be controlled
