Electronics Forum | Sat Nov 22 09:27:18 EST 2008 | davef
IPC-HDBK-001 w/Amendment 1 Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001B to C Comparison). During fabrication and storage, both components and PWBs will often absorb water. If left in the device, this water will vaporize at solderi
Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris
I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90
Electronics Forum | Fri Jun 01 10:52:37 EDT 2012 | blnorman
Neither the Omega meter nor the IC are officially "destructive" tests, but everywhere I worked we treated them that way. The boards were scrapped after the test. The Omega meter can be tested at elevated temps, but the IC sample is extracted at ele
Electronics Forum | Fri Sep 25 22:23:35 EDT 1998 | Mike C
| Anyone Knows a chamber(or something like this) to keep the IC's out of reach of humidity, information about where can I buy one I apreciate. | Thanks | AC Al Consider the cheap way out, (Working for a contract manufacturer I have to sometim
Electronics Forum | Fri Feb 20 08:56:42 EST 2004 | davef
We successfully clean WS flux on 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use no clean, because we cannot remove the flux residue from under them efficiently. Use ion chromatography testing to be sure it is clean under the BGA. IC is the on
Electronics Forum | Tue Apr 27 10:05:36 EDT 2004 | Francois Monette
Hi CT, The bake requirements for Moisture Sensitive Components are defined in table 4-1 of the joint IPC/JEDEC J-STD-033A (link for free download at http://www.cogiscan.com, click on MSD Knowledge Base/Introduction). Normally you pick the highest
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Mon Apr 26 12:51:45 EDT 1999 | Bob
Steve, Moisture sensitivity needs to be taken seriously. Being in the commercial end of electronics now, I am using many plastic packages. Unfortunately, moisture sensitivity processing is not black and white and it does require procedures and dis
Electronics Forum | Wed Sep 08 17:34:26 EDT 1999 | Earl Moon
| | | | Hello: | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into th
Electronics Forum | Wed Sep 08 20:26:30 EDT 1999 | Jackie Hsieh
| | | | | Hello: | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting int
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