Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Electronics Forum | Tue Mar 25 09:35:28 EDT 2014 | emeto
Have you tried to bake the boards before you process them?
Electronics Forum | Thu Jan 26 17:59:07 EST 2006 | GS
How is RH% inside your Dry Cabinet ? What is the most critical MDL of your MSDs soldered on your board ? Best instructions about Handling of MSD you can get from Standard J-STD-033B/C. The defects you encountered at test it could be moisture absor
Electronics Forum | Thu Mar 03 12:57:10 EST 2022 | dontfeedphils
Probably need more info on the PCB and why baking before reflow processing is part of your process, but if you're baking before reflow it makes sense you'd bake before rework. Is there a reason you don't AOI before wash?
Electronics Forum | Thu Jul 12 02:15:53 EDT 2012 | thmeier
Check also the specs / recommendations of your PCB manufacturer. We bake boards 4h/120°C before reflow and after automated cleaning (it´s not FR4!) and also if we have to rework with the autometd rework- stations (massive IR underheating ,..). Regar
Electronics Forum | Wed Mar 02 13:15:16 EST 2022 | chris007
I am currently working on a manufacturing flow where some PCBA are processed with reflow oven (after being baked before processing), then cleaned with bath, then passed into contaminometer, passed into AOI. The point is after all of this, if AOI dete
Electronics Forum | Fri Feb 28 08:57:34 EST 2003 | davef
We used to bake [100*C for 6 hours] all of our boards, but no longer bake at all. Before going off, your bake recipe is probaly OK. If anything, it's probably too short. Consider measuring the weight of wet boards, baking for a time, measure, bake
Electronics Forum | Thu Jan 31 13:19:28 EST 2002 | dason_c
What is the baking time/temperature standard for the PCBA before BGA rework?
Electronics Forum | Thu Mar 03 14:01:16 EST 2022 | chris007
Hello Baking before solder pasting and reflow actually due to poential moisture development. This is JDEC requirement I believe to do so. We AOI after cleaning so we AOI a clean PCBA
Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs
Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug
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