Electronics Forum | Thu Jun 29 04:50:42 EDT 2023 | SMTA-70263692
This looks like it could be related to oxidation.Do you per-bake your pcb before assembly to remove any moisture inside your board panel?
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Wed Dec 17 10:25:47 EST 2003 | blnorman
I may have asked this question before but couldn't find anything when I ran a search. Question, after ultrasonically cleaning our boards we bake them out to drive off residual moisture. Current requirement is 24 hours @ 105�C. I seem to remember a
Electronics Forum | Tue Aug 25 08:04:26 EDT 2009 | davef
Trapped moisture can be a problem, and one standard recommends baking a PCB for a minimum of 4 hours at 93+/- 5.5ºC before conformally coating. [NASA-STD-8739.1, “Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Ele
Electronics Forum | Mon Aug 30 14:14:23 EDT 2010 | sreid
Thanks Dave, I was able to get an automated dispenser to apply an amount of paste that should be sufficent. My only question is should I bake the boards before solder is applied and the boards are reflowed. I ask this because the boards have been s
Electronics Forum | Thu May 31 22:35:23 EDT 2012 | jacktan
I have encountered PCB delam issue with high density PCB. PCB has 42 layers , 5 mm thickness ,laminate material is NelcoN4000-13EP,Tg 210C and Td 350C. Have pre-bake at 125 c for 12 hrs before assy.My reflow temp is standard with 243 peak and TAL is
Electronics Forum | Thu Dec 04 00:22:11 EST 2008 | maacolomer
Hi Steven, The 24 hrs bake is an overkill according with various J-STDs. Assuming a bake temperature over the 100 Celsius degrees. There are several factors to be considered before deciding the best methodology to wash misprinted board. However,
Electronics Forum | Thu May 20 19:11:48 EDT 1999 | Earl Moon
| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | Deo
Electronics Forum | Thu Oct 21 09:08:32 EDT 2021 | korb23
Ive done this before and it seemed fine for me although id didnt bake it more than twice.
Electronics Forum | Fri Mar 26 03:25:02 EDT 2010 | grahamcooper22
HI, regarding the baking....why are you doing it every 72 hours ? How many times has each device been baked ? If you are worried about moisture in the devices the best policy is to store them correctly in dry packs or dry cabinets or bake them once j
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