Electronics Forum | Fri Oct 19 00:37:43 EDT 2001 | ianchan
Hi, my guys did such solder paste deposits on PCB bareboards before, (before my physical join with my current company), approximately 2-3 years ago, for a small Lot run. What the PCB supplier did was to apply "block" shaped Sn/Pb paste alloy onto t
Electronics Forum | Sun Jul 18 21:15:05 EDT 2004 | Thomas
Hi all, Need some advice on wavesolder pinholes issues. The PCBs are stored in a warehouse for 6 months and not vacuum packed. Before wavesodlering, boards are baked 2 hrs at 110 deg. But every piece of it has pinholes at random locations. PCB i
Electronics Forum | Sun Jul 18 21:11:03 EDT 2004 | Thomas
Hi all, Need some advice on wavesolder pinholes issues. The PCBs are stored in a warehouse for 6 months and not vacuum packed. Before wavesodlering, boards are baked 2 hrs at 110 deg. But every piece of it has pinholes at random locations. PCB i
Electronics Forum | Fri Aug 27 00:26:14 EDT 2004 | charly
hi, encounter few cases PCB was delam after reflow, and the supplier was refuse that this is a PCB manufacturing defect as the fallout is low within one lot. the cost for this scrap is high after PCBA level, my query here are 1) is there any way
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Electronics Forum | Thu Nov 13 12:08:50 EST 2008 | cisridn
I define First Pass yield without any repairs. But I only consider a PCB to need repair if it fails test. Our boards are inspected before testing and any work done before testing, I consider to be rework and is part of the SMT process.
Electronics Forum | Thu Nov 28 20:37:40 EST 2002 | Dreamsniper
I'm in the process of generating work instructions for our stores and production process with regards to moisture sensitive devices.And I'm a bit confused. I found out that we have many TSOP's, QFP's and BGA parts in sealed bags that have not been op
Electronics Forum | Wed Apr 28 15:08:10 EDT 2004 | russ
This could be a long shot but here goes. I have found that if flux is applied in excess that it will actually "move the solderballs" during reflow. I have actually seen where the balls are completely outside the package and oviously there are short
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver
Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol
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