Electronics Forum | Tue Oct 27 06:29:49 EDT 2009 | lococost
Yes it is possible, and yes you shouldn't trust boards that have this problem. You're best off baking PCB's this old befor reflow. This looks like barrel cracking, a quick google gives: http://www.eco3.co.uk/e3toolkit/e3toolkit/modules/05/05_04_j_pc
Electronics Forum | Sun May 17 13:46:30 EDT 1998 | Steve Gregory
Hi All! I've been reading this conversation which prompted me to break out the IPC-SM-786A from the IPC manuals from our parent company in Maryland sent us (we're just starting up in California). It's the Procedures for Characterizing and Handling of
Electronics Forum | Mon Apr 12 08:10:17 EDT 2004 | wgaffubar
We are sometimes, not always, seeing very large voids in the solder joints of BGA's with Via in Pad. Some lots of PCB will have the voids and other lots of boards will not. I feel the via's are outgassing during reflow, due to the PCB not having been
Electronics Forum | Fri Mar 30 09:23:22 EDT 2007 | JD
I agree completly. When the techs in the factory bring boards to me for the PCB operators to replace BGAs on I ask lots of questions before releasing it to PCB dept. Many times its a guess on the techs part because they are frusterated with troublesh
Electronics Forum | Thu Jun 20 04:53:13 EDT 2002 | hany_khoga
Thanks Dave but unluckily my sweet BGA�s are surrounded by plastic connectors with hundreds of pins. Also my PCB�s are 4-layers so just thinking of doing what you suggest means ruining them for me. To be honest I tried bypassing the baking issue bef
Electronics Forum | Fri Sep 29 05:35:50 EDT 2006 | aj
Guys, We have experienced some delamination on 3 of 45 boards so far.(not exactly delamination yet but a gathering of moisture is evident is certain areas). We have the build on hold while we sort it out with the supplier. We are running a Leadfree
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c
Electronics Forum | Mon Aug 11 05:26:55 EDT 2008 | gersla
Hi All We are looking for not expensive solution for misprint PCB cleaning for both one and double side assemblies. We have tried different ways and cleaning solutions like: IPA, Vigon Zestron SD300, Vigon SC200 by deep the boards in to stainless ste
Electronics Forum | Wed Aug 02 06:48:56 EDT 2023 | kirill
Use T5 solder paste Make sure you dont have too much paste, usually 1 time printing instead of 2. Make sure the component is baked before production. Re-check your profile on the reflow. Could be also a bad pcb edit, nothing you can do there.
Electronics Forum | Fri Aug 12 22:10:24 EDT 2005 | Mika
I agree with all the prior postings! But I have some additional thoughts about this. If there is a build up of moistures (% humidity) inside the pcb; before you reflow the pcba; then you will have the result out of the oven, just as you described. My
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