Full Site - : bake pcb before reworking (Page 21 of 44)

Re: baked on water soluble flux residue betwwen fine pitch comp.

Electronics Forum | Fri Dec 01 16:02:33 EST 2000 | Jim M

Thanks for your reply. I 've tried to clarify and answer your questions. The water soluble paste used is WS3060, type 4. The boards are sent through a inline di cleaner after reflow. There is a hot Di waterwash, rinse and then hot air to dry the wa

Re: IR rework stations

Electronics Forum | Thu Sep 23 08:59:20 EDT 1999 | Wolfgang Busko

| Hiya, | | Could anyone please suggest recommended manufacturers of | IR rework stations for the removal of various SMT comps. | | Cheers | Why IR ? Ok, I�ve seen only one but that thing burnt the PCB before the solder was melting and costs a lo

PAD come off from PCB after Rework

Electronics Forum | Wed Apr 19 09:07:44 EDT 2006 | russ

Many times a pad that has no signal trace going to it will come off. It does happen from heat and time as noted before. Somtimes even the best rework person will remove them. If this can not happen in your situation I would recommend that you use

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 02 17:09:02 EDT 2002 | dason_c

Francois, thank you very much for your recommendation twice. Is it any harmful for my evaluation? The component will go thro the reflow after drying process and not just only check the weight. The evaluation will go thro the C-SAM as Dr. Shook doc

Military Lamina bake-out

Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef

IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for

About the PCB gold finger contamination.

Electronics Forum | Thu Sep 19 21:17:50 EDT 2002 | Sam

We had encountered similar problem before. But the cause was found out to be the poor good plating, instead of contamination. The way we dealt with that was sending them to the supplier for rework. It may be the fastest and most relaibility way. Goo

ENIG-BLACK PAD!!!!

Electronics Forum | Fri Dec 08 00:02:35 EST 2006 | Jack

Hi all, I found this article (Dealing with "the black pad defect)about reworking bare PCB with black pad symptom...Use HASL to treat black pad..Have you guys try this before?? www.smta.org/files/SMTAI01-Jay

BGA rework with unplugged vias PCB

Electronics Forum | Thu Dec 21 22:56:30 EST 2006 | davef

Dennis We know that cyanoacrylates are flammable and breathing hazard before curing, but are unaware that the cured adhesive had those properties also. Can you give us documentation of that fact?

BGA rework

Electronics Forum | Fri Mar 30 14:47:27 EDT 2007 | GS

MSL 3) By SAM (Scanning Acoustic Microscope) before to remove them from PCB, you could identify if de-laminated or not and the degree of delamination. Best Regards...GS

Rework PCB's with coins

Electronics Forum | Fri Mar 19 16:56:42 EDT 2010 | cisridn

Both the coin and the device flange that is soldered to the coin have a gold finish. A solder preform is placed in the pocket of the coin before the device is placed prior to reflow. Solder adhere's to both surfaces


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