Electronics Forum | Wed May 05 14:37:58 EDT 2004 | Gaz
I'm not in production, but I do repairs by replacing CSP & LGA components on PCB's. Our components are supplied sealed in packs of 5 with a humidity indicator card and desiccant. I recently failed an audit by the company I do the work for because th
Electronics Forum | Sat Jun 13 11:00:21 EDT 1998 | Earl Moon
| We are very concerned about outgassing in wavesoldering. | If anyone knows how to use properly well pcb's before soldering in order to avoid this problem please let me know. I have this problem in FR4 large double sided pcb's. My soldering line is
Electronics Forum | Fri Jul 13 08:54:18 EDT 2007 | rgduval
Has your board house reviewed the PCB layer stack? Make sure that the layers are balanced in copper weight, etc? Have you tried pre-baking the boards? We just had an issue with some boards warping that have never warped before for us. It happened
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Wed Oct 10 21:31:17 EDT 2001 | cnoonan
I used to rework many types of BGA's including ceramic. We always preheated the whole board to around 115 c before attempting to remove or place. Now I find myself in a new company with different ideas. Do any of you have a site that has exact rec
Electronics Forum | Wed Oct 10 21:35:39 EDT 2001 | cnoonan
I used to rework many types of BGA's including ceramic. We always preheated the whole board to around 115 c before attempting to remove or place. Now I find myself in a new company with different ideas. Do any of you have a site that has exact recomm
Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson
| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin
Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS
Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl
Electronics Forum | Thu Sep 30 21:37:44 EDT 1999 | Dreamsniper
| | Hi everyone, | | | | Greetings! | | | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | | Insufficient Solder an
Electronics Forum | Wed Aug 14 16:44:54 EDT 2002 | dragonslayr
What is the surface finish? HASL, Entek? what? If HASL, ask your fab supplier for recommendations, maybe even rerun the boards through the HASL process. The fab house would have to strip off the old coating and reapply. Just a thought, depends on y
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