Electronics Forum | Thu Sep 30 21:37:44 EDT 1999 | Dreamsniper
| | Hi everyone, | | | | Greetings! | | | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | | Insufficient Solder an
Electronics Forum | Thu Sep 30 12:29:01 EDT 1999 | Dave F
| Hi everyone, | | Greetings! | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | Insufficient Solder and some solder ne
Electronics Forum | Tue Jul 18 18:53:23 EDT 2006 | Mike F
Is it showing up after wave or reflow soldering, or after hand soldering? If the delamination or blister bridges between traces you have the potential for a short circuit between those traces. A delamination might be repairable, but in most cases i
Electronics Forum | Wed Oct 20 10:49:04 EDT 1999 | Brian
Hi! Stu's method is a half-truth. What it measures is the aggregate of all volatile material with a significant vapour pressure at the baking temperature, not just H2O. Short of very complex methods, it could be complemented by a comparitive measur
Electronics Forum | Mon Aug 01 18:50:46 EDT 2005 | crishan
Hi Cecil, We using conformal coating in our manufacturing area, we did use to use Humiseal, others have been Bectron and Peters. We recentalt switched all lacquering to Peters, since it is lead free and it is a lot friendly than Humiseal. To answer
Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS
Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125
Electronics Forum | Thu Sep 23 13:17:06 EDT 1999 | Jeff Ferry
| | | Hiya, | | | | | | Could anyone please suggest recommended manufacturers of | | | IR rework stations for the removal of various SMT comps. | | | | | | Cheers | | | | | Why IR ? Ok, I�ve seen only one but that thing burnt the PCB before the s
Electronics Forum | Thu Sep 02 21:19:25 EDT 1999 | NAZEEH CHAUDRY
| | Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | | | | Insufficient solderpaste. "No flux" (sat too long after print). | | Those are what I've experienced. | cbga or pbga if pbga check thermal prof
Electronics Forum | Mon Aug 25 00:31:53 EDT 2003 | Dennis O'Donnelll
It could be moisture in the BGA. You should always bake the BGA before installation of course. But most likely you are usingf too much heat or too fast of a ramp speed. Make sure your top heater temp is below 230C. Set top heater to 220C, then adj
Electronics Forum | Sat Mar 06 06:15:14 EST 2004 | Bryan
Thanks Tommy. In fact I've tried many types of profile,but it didn't work.I'll try to make the peak temp. as low as 205C and dwell long as in some threads Dave said.I've tried baking the BGA and PCB before mounting also dindn't work.yes,I've heard th
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