Full Site - : bake pcb before reworking (Page 29 of 46)

RoHS Board Delamination

Electronics Forum | Tue Oct 24 15:46:09 EDT 2006 | aj

Mark, The pcb manufacturer recommended we bake the boards , so we did. I even weighed a batch before and after and seen slight decrease possibly 0.1g in weight. However we still seen some delam after all this. I am confident our issue has nothing to

PCB Warps

Electronics Forum | Wed Dec 22 18:16:46 EST 2010 | padawanlinuxero

Hello ! I have a problem with one of high runner, our board comes in a seal package with dessicant cant really tell you how much RH% is inside the bag, but our board does not spend a lot of time in the shelf just some days or a couple of weeks max,

Mid Grade BRA Rework (20K to 50K)

Electronics Forum | Mon Nov 13 13:26:43 EST 2017 | rcooley4

Hi all, I'm in the market for a BGA rework machine capable of handling a wide range of PCB's, anything from little 2"X2" board up to 15"X15" back-plane boards that are 0.100" thick. I would like to find a machine that can remove BGA's & QFN's, clean

Re: De-wetting

Electronics Forum | Thu Aug 19 19:04:55 EDT 1999 | Brian Wycoff

| | Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use

Re: conformal coating after rework

Electronics Forum | Wed Jan 27 09:00:56 EST 1999 | Chris Fontaine

| | I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the

FR4 boards Delamination Cause?

Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef

Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been

Re: Pre-heat for Ceramic Capacitors

Electronics Forum | Sat Mar 06 08:01:45 EST 1999 | Scott Cook

| Can someone please advise me to the rework procedure for removal and replacing Ceramic Chip Capacitors (e.g. 0805, 1206, etc.)? | | Is it necessary to pre-heat ceramic capacitors before soldering them onto a PCB with a soldering iron? Is this just

Re: IR rework stations

Electronics Forum | Thu Sep 23 13:37:06 EDT 1999 | Earl Moon

| | | | Hiya, | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | Cheers | | | | | | | Why IR ? Ok, I�ve seen only one but that thing burnt the

Re: IR rework stations

Electronics Forum | Thu Sep 23 14:30:09 EDT 1999 | Earl Moon

| | | | | | Hiya, | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | Cheers | | | | | | | | | | | Why IR ? Ok, I�ve seen on

Quality control in manufacturing

Electronics Forum | Fri Sep 02 19:31:40 EDT 2011 | jlawson

I agree that if information is processed correctly up front in process down stream QA becomes less expensive ie AOI etc as AOI at end of lines is telling you you have made mistakes in up stream. I better to eliminate mistakes or have process to avoid


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