Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Fri Aug 17 08:37:47 EDT 2001 | jbieber
Gregory, I think that the profile is too radical, i.e. zone 6 to zone 7 temperatures are too far apart. I would guess that the solderjoints have not all reached 183C in zone 6 which is why the uBGA's do not have a symmetrical ball collapse. You may
Electronics Forum | Mon Sep 27 12:54:44 EDT 1999 | Earl Moon
| | | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding ne
Electronics Forum | Mon Sep 27 16:48:29 EDT 1999 | Elliott
| | | | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding
Electronics Forum | Mon Sep 27 22:53:46 EDT 1999 | Earl Moon
| | | | | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shieldin
Electronics Forum | Mon May 31 15:09:56 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Mon May 31 15:10:14 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan
Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi
Electronics Forum | Tue Sep 28 08:55:21 EDT 1999 | Earl Moon
| | | | | | | | | | | Hiya, | | | | | | | | | | | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | | | | | | | | |
Electronics Forum | Thu Apr 17 05:14:40 EDT 2008 | gregoryyork
I have seen similar things like this before with Solder Resist redepositig back on the pads, this is a clear residue very hard to see. Solder resist will obviously resist solder adhering to it. If you rework the boards then the heat of the iron will
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