New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Rework & Repair Equipment
http://www.flason-smt.com/product/SMT-Assembly-line-Auto-BGA-Rework-Station-Optical-Alignment.html SMT Assembly line Auto BGA Rework Station Optical Alignment Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
SMT Assembly line Auto BGA Rework Station Optical Alignment Demensions:L650×W630×H850mm SMT Assembly line Auto BGA Rework Station Optical Alignment PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Pr
New Equipment | Rework & Repair Equipment
China BGA Rework Station factory Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Weight:Approx.60KG Product description: China BGA Rework Station factory, PCB size:Max 400×390mm, Applicable chips:Max
New Equipment | Rework & Repair Equipment
Auto BGA Rework Station Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Weight:Approx.60KG Product description: Auto BGA Rework Station, PCB size:Max 400×390mm, Applicable chips:Max 80×80mm Min 1×1 mm
BGA Rework Station Demensions:L650×W630×H850mm BGA Rework Station PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Product description: BGA Rework Station INQUIRY BGA Rework Station Pr
Technical Library | 2020-01-02 12:16:02.0
A customer contacted the Helpline with the concern that parts being used in their assembly may possibly be counterfeit components. The counterfeiting of electronics components is a world-wide problem, and the threat today is even more evident than ever before. Any company, large or small, that manufactures assemblies using electronics components is equally susceptible to using counterfeit devices in their assemblies. In most cases, counterfeit components aren't discovered until after the component has already been placed on a printed circuit board (PCB), usually during first article electrical test. At this point, the only recourse is to debug the circuit to determine the faulty component and rework each PCB already in production to replace the faulty component. As one might easily surmise, this is a rather costly process; world-wide, counterfeit components account for over $15B loss in sales annually!
The LRD Range of Automated Optical Inspection systems are a direct result of a partnership between Detech Europe and Dayco Developments. The two partner companies have many years of combined experience in not only developing user friendly and innovat
The OvenWATCH® system is designed to continuously monitor the quality of PCB assemblies as they pass through your reflow ovens. Now the OvenWATCH® system can provide you and your customers with the confidence of knowing that the quality assurance of
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
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