Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef
Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff
Electronics Forum | Sat Nov 22 09:27:18 EST 2008 | davef
IPC-HDBK-001 w/Amendment 1 Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001B to C Comparison). During fabrication and storage, both components and PWBs will often absorb water. If left in the device, this water will vaporize at solderi
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Mon Nov 20 06:51:00 EST 2000 | Daniel Carlsson
Does anyone have information regarding: -Moisture level (wt%) that may cause delamination in PCB�s. -Baking time and temperature if using a Vacuum Drying Cabinett and if using an air oven. (What I�m most interested of is Poly-Imid-Aramid.) -Are ther
Electronics Forum | Tue May 14 14:59:47 EDT 2002 | fmonette
Greg, As Dave pointed out, the main reason to bake components is to remove absorbed moisture from moisture-sensitive components. All you need to know on this subject, including the specific bake conditions (temperature and duration) are clearly s
Electronics Forum | Fri Oct 19 00:37:43 EDT 2001 | ianchan
Hi, my guys did such solder paste deposits on PCB bareboards before, (before my physical join with my current company), approximately 2-3 years ago, for a small Lot run. What the PCB supplier did was to apply "block" shaped Sn/Pb paste alloy onto t
Electronics Forum | Sun Jul 15 20:10:09 EDT 2001 | Danial
What is the best method to repair Warped PCBA. Obviuosly twisting it back to make it flat would be a disasterous. The method that I've tried wold be mounting the assembled board to the flat holder with the clamp and bake them at 120 Deg C for about 4
Electronics Forum | Wed Oct 20 10:49:04 EDT 1999 | Brian
Hi! Stu's method is a half-truth. What it measures is the aggregate of all volatile material with a significant vapour pressure at the baking temperature, not just H2O. Short of very complex methods, it could be complemented by a comparitive measur
Electronics Forum | Wed Jul 11 22:48:54 EDT 2012 | joeion
It is correct to remove moisture in PCB by baking. But I think the time and temperature is too little. According to our experience, it should be more than 60min at 120 centigrade degrees.
Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg
What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often
