Electronics Forum | Fri May 22 11:12:25 EDT 1998 | Mike Glenn
| | Does anyone know about low pressure/low temperature | | ovens used for baking of moisture senstive | | components? | | Thanks | I need to know from where your need came. I usually just bake in conventional ovens with specified times and tempera
Electronics Forum | Fri May 22 15:45:31 EDT 1998 | Justin Medernach
| Does anyone know about low pressure/low temperature | ovens used for baking of moisture senstive | components? | Thanks Mike, Check out the people at 3M. They have come out with high temp reels and carriers that can withstand a bake. Try the gu
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Wed Aug 07 09:05:11 EDT 2002 | davef
N2 PPM vs %RH? With a firm grasp of the obvious, reflow oven manufacturers rig N2 ovens differently than non-N2 ovens. The N2 displaces O2. Usually N2 oven monitor something or other to give an indication of N2 ppm. %RH really isn't part of the eq
Electronics Forum | Thu Jul 14 16:38:13 EDT 2005 | sleech
Our present lab went "South." We need a lab that can do temperature/humidity conditioing, convection oven baking, C-Mode Scanning Acoustical Microscopic package inspection and "No-Pb" reflow simulation. We are evaluating a low temperature package dry
Electronics Forum | Tue Jun 17 09:00:58 EDT 2003 | fmonette
Good question, here is the short answer : The problem is that dry storage is not the same as a bake process. If you want to bake saturated components, this should be done at higher temperatures. The IPC/JEDEC standard provides a table with bake temp
Electronics Forum | Mon Jun 13 12:58:10 EDT 2011 | deanm
We find it is a bigger issue in the summer when there is more humidity in the air even though our facility is air conditioned. We've also seen similar boards go through the same process and vendor A has problems and vendor B doesn't, so fabrication t
Electronics Forum | Thu Aug 15 22:35:54 EDT 2002 | Brandon
I've done some experiments on baking parts as we got pop corning QFP's on our production line. This QFP has moisture level of 5 and I baked them @ 125'C for minimum of 12 hrs. So far results were great but I have a question: Forum says that I cannot
Electronics Forum | Tue Aug 25 03:24:11 EDT 2009 | fiona_j
Hello, I have been recently bringing a new RoHS wave soldering machine into production. Unfortunately, I am finding many of the boards are experiencing blow holes. It is always silver plated PCBs and I believe it is related to moisture ingress. I n
Electronics Forum | Thu May 06 08:29:41 EDT 2004 | Christopher Lampron
10% RH) Do these stored components need baking before I use them now or not? * Depends on the MSD level (should be marked on packaging) Level 6 component need to be baked prior to asembly no matter what. Other levels should be OK if they were store
