Electronics Forum | Wed Feb 21 14:18:37 EST 2001 | jagman
Could anyone please give me some insight on the time/temperature requirements for curing SMT adhesive used for a high temperature (96/4 solder) application in a bake oven, rather than using reflow? I understand that it would probably vary from epoxy
Electronics Forum | Mon Jul 07 09:00:50 EDT 2008 | josh_brubaker
These images are of two melted matrix trays, full of BGA components, which were left to bake in an oven over the weekend. The oven temperature controller was not checked after a recent power failure and reached a temperature of 715�F. The two trays m
Electronics Forum | Fri May 22 13:20:33 EDT 1998 | Earl Moon
| | | Does anyone know about low pressure/low temperature | | | ovens used for baking of moisture senstive | | | components? | | | Thanks | | I need to know from where your need came. I usually just bake in conventional ovens with specified times a
Electronics Forum | Wed Oct 14 04:01:28 EDT 1998 | Joakim Fagerlund
We have problems with achiveing a void free soldered joint when we seal different kind of packages (QFP,LCC and PGA) We think the problem partly is due to outgasing from the die-adhesive (silver-glass) Does anybody have any reccomendations what to d
Electronics Forum | Mon Jul 04 05:41:24 EDT 2016 | slouis2014
Can anybody advise what temperature can a BGA component on reel be bake and how long.
Electronics Forum | Thu Jun 11 10:02:36 EDT 2009 | dyoungquist
Our cleaning process involves the assemblies being completely immersed in the water bath of the ultrasonic cleaner. The assembly has a QFP44 on it. Customer stated that when these assemblies have been cleaned with water in the past (at a different
Electronics Forum | Wed Mar 29 04:14:49 EST 2000 | Marc
Charlie B: You mentioned that you have an air conditioned environment and a RH 0rf 50, baking the boards is predominately done when the history of the PCB delivery and / or previous storage conditions are un known. When I was with a CM, we did this a
Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma
Electronics Forum | Fri Mar 26 03:25:02 EDT 2010 | grahamcooper22
HI, regarding the baking....why are you doing it every 72 hours ? How many times has each device been baked ? If you are worried about moisture in the devices the best policy is to store them correctly in dry packs or dry cabinets or bake them once j
Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette
Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes
