Petroferm has the solution for removal of post reflow residues from every available solder paste and flux. Petroferm offers a complete line of aqueous, semi-aqueous, and solvent defluxing chemistries for use in every brand and style of cleaning equip
Industry News | 2009-09-17 14:59:53.0
TORRANCE, CA — September 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight Sayaka’s Table-Top Router, Hirox’s 3-D Microscope and the McDry MB-302 Low Temp Baking Cabinet in booth 617 at the upcoming SMTA International exhibition and conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
SJ101 Sintered Welding Flux Specification:GB/T 12470-2003�� ���������� F48A4-H08MnA; F55A4-H10Mn2 Equal to: AWS A5.17-97; AWS A5.23-97 F7A4-EH14; F8A4-EA2-A2 ����Description: SJ101 flux is a kind of fluorine-basic sin
Industry Directory | Manufacturer
Expert in Humidity Control Cabinet (compliant to JSTD-033C), Baking Oven, Nitrogen Cabinet, Alarm Hygrometer, Wireless Monitor
New Equipment | Board Handling - Storage
Eureka TUS-2001 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-2001 Capacity: 1314 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing door for 30 seconds or less. Ext
Cable Wrapping Polyimide F46 Tape is a dry adhesive tape, which is made by a polyimide film coated with Teflon FEP fluoropolymer adhesive on one side(FH) or both sides (FHF) upon high_temperature baking. Thickness: 0.0375mm, 0.04mm, 0.05mm, 0.06mm
New Equipment | Board Handling - Storage
Eureka Dry Tech XDC-501 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://www.eurekadrytech.com/fast-super-dryer/xdc-500 Capacity: 372 Liters Humidity Range: LESS THAN 5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after acces
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
Technical Library | 2024-09-02 18:48:58.0
The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.
PTC Thermistors Motor Sensor is ceramic PTC Thermistor pellet with insulated wire cable, used for motor temperature sensing and over-temperature protection, by using PTC thermistor characteristics resistance rises sharply at Curie temperature. PTC T
