Electronics Forum | Tue Sep 07 17:12:34 EDT 2004 | davef
No one knows what type of board you use. So, assuming you're talking a fairly standard FR4. Q1a. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? A1a. We'd guess your board could take 250*C for may
Electronics Forum | Fri May 09 09:09:22 EDT 2003 | fmonette
Phil, here is why "dry cabinet storage may not stop the clock" : The moisture diffusion inside a component is actually quite complex. When previously exposed components are returned to dry storage, the moisture gradient that is already absorbed in
Electronics Forum | Wed Jul 04 09:58:50 EDT 2012 | daxman
Assuming that you have a saturated moisture-sensitive component: At what temperature would popcorning or internal component damage occur? I would guess that it would be at a temperature where water would boil, around 100 degrees? However, the JEDEC J
Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala
Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u
Electronics Forum | Thu Mar 31 06:09:19 EST 2005 | amstech
Yes, components do contribute to the non wets in fine pitch reflow. Oxidation is the main culprit. May ask where it is coming from. Can not say in particular. May be burn in test process or end of line baking, hot / cold testing and need to run DOE'
Electronics Forum | Thu May 18 08:12:22 EDT 2006 | marc
smt You should have no issue using your exsisting oven for both leaded and lead free materials if the machine is capable of delivering the desired profiles. One aspect that makes a "lead free" oven is the design of the system. Ability to reach th
Electronics Forum | Wed Apr 23 19:00:39 EDT 2008 | stevek
It depends on the laminate but a PWB is like any other MSL component. Some fab shops are only waranting standard FR4 laminates for 45-60 days when processed at lead free temperatures. The best thing I can say is to try some weight gain/loss experim
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
Electronics Forum | Tue Dec 05 15:10:55 EST 2000 | Francois Monette
Victor, here are a few more elements of information to answer your question. Both the temperature and relative humidity on the manufacturing floor have a significant impact relative to the rate of diffusion of moisture inside a plastic package and t
Electronics Forum | Wed Sep 29 07:28:04 EDT 1999 | Wolfgang Busko
3�C/min) or maximum temperature (~240-250�C)." For the correct handling of moisture sensitive devices and prebaking advices see IPC-SM-786A or newer publikations. I encountered the following: A tray of sample BGAs was send to me proper packed and se
