Electronics Forum | Wed Aug 14 16:30:55 EDT 2002 | sleech
Dan: Until I got deep into development of a vacuum assisted moisture removal process, I always thought that the bake process would be saddled by the lack of atmosphere in the chamber. I later learned that the conduction of temperature at reduced atm
Electronics Forum | Thu Feb 05 15:12:58 EST 2004 | pjc
There is the IPC/JEDEC J-STD-033 that addresses moisture sensitive components. Go to http://www.ipc.org for the standard. Your factory/storage area environment will dictate exposure times allowable. Be mindful of temperature and humidity changes- lik
Electronics Forum | Tue Mar 30 07:34:46 EST 2004 | TONY
We are running double side micro bga boards and we were told to run one side, wash them, put them in the oven at 125c for 1 hour and putting them in the dry cabinet until we run the other side. Is this necessary? It is time consuming for us to wait
Electronics Forum | Mon Sep 06 20:18:37 EDT 2004 | charly
hi, we are running high mixed low volume here, and i encounter many pcb delam after reflow issue. here some doubt need ur advise: 1. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? if i allow bare
Electronics Forum | Sun Mar 25 22:21:03 EDT 2007 | sleech
Let me explain. At 125 degrees C, the oven is above the boiling point of water. It will be vaporized and eventually be vented from the oven. However at temperatures of 90 degrees c and lower the relative humidity becomes an issue. For the life of me,
Electronics Forum | Wed Jul 09 18:25:32 EDT 2008 | jmelson
There are temperature controllers that can be configured for a "safety stat" mode, so they blow a fuse to the main heater control if it goes, say, 10C or some reasonable fluctuation above the setpoint. It might be a VERY reasonable thing to add to y
Electronics Forum | Thu Sep 03 01:15:52 EDT 2020 | kylehunter
> The problem that we have seen applying NC flux > (EF2210) at selective solder is that the flux > overspray (relative to the nozzle path) did not > see high enough temperature to activate the flux > and turn it to a non-conductive
Electronics Forum | Wed Sep 22 21:15:44 EDT 2021 | djenkins62
Hello Everyone: Heat Can Be Very Damaging to Boards and well as extended oven time can cut into valuable production time. Steel Camel is testing ambient temperature drying to remove diffused and embedded moisture in PCBs. We are seeking scrap pie
Electronics Forum | Tue Jul 02 17:09:02 EDT 2002 | dason_c
Francois, thank you very much for your recommendation twice. Is it any harmful for my evaluation? The component will go thro the reflow after drying process and not just only check the weight. The evaluation will go thro the C-SAM as Dr. Shook doc
Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef
Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste
