Full Site - : bake temperature (Page 10 of 36)

ECD Ranks Highest Among Soldering Equipment Providers, Honored with Second Consecutive Service Excellence Award

Industry News | 2017-03-01 14:41:48.0

ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.

Electronic Controls Design Inc. (ECD)

Emerson Rosemount FISHER 01984-4282-0001  INTERFACE MODULE

Emerson Rosemount FISHER 01984-4282-0001 INTERFACE MODULE

New Equipment | Industrial Automation

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XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Seika Machinery to Exhibit at SMTA Dallas 2009

Industry News | 2009-03-02 00:10:24.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.

Seika Machinery, Inc.

Humidity bake bends leads

Electronics Forum | Fri Apr 16 09:40:04 EDT 1999 | Gerry G

While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. I thought I'd ask some experts. Any help guys?

BGA bake out....

Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette

The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac

Re: Humidity bake bends leads

Electronics Forum | Sun Apr 18 03:58:26 EDT 1999 | P.L. Sorenson - Technical Consultant

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | To remove moisture from low quanti

Re: Humidity bake bends leads

Electronics Forum | Fri Apr 16 19:02:39 EDT 1999 | Dave F

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Gerry: I imagine there could be s

Re: Humidity bake bends leads

Electronics Forum | Fri Apr 16 19:52:39 EDT 1999 | Scott McKee

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Let me get this straight... He's

Re: Humidity bake bends leads

Electronics Forum | Mon Apr 19 17:44:43 EDT 1999 | Chrys Shea

| | While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | | I thought I'd ask some experts. Any help guys? | | | Gerry: I imagine there co

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 19:13:37 EDT 2007 | htran

DaveF, Our customer requirement is to comply with IPC-STD-001 but the J std doesn't specify the bake out temperature for populated boards and the moisture absortion rate. Right now we are baking the populated PWAs after aqueous wash at 80C at 18-48


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