IDC is the developer of a low temperature baking process for removing moisture from moisture sensative package, while they remain in either tape or tubes. It is currently engineering equipment to support the process.
Industry Directory | Manufacturer
Design and Manufacture Desiccant Dry Cabinets for low humidity storage and baking of moisture sensitive components, PCBs, electronic materials, lab samples, digital media and medical devices.
New Equipment | Cable & Wire Harness Equipment
Application: Aluminum tube NTC thermistor temperature sensor probe assembly for coffee maker, cookie maker, bread maker, roaster, toaster and other food processing, especially for coffee maker heating tray, bake tray. Resistance @200C R
Reflow cycle - runs the oven through the pre-defined temperature profile.> Bake cycle - used to drive the moisture from moisture-sensitive components.>
Electronics Forum | Fri Apr 16 09:40:04 EDT 1999 | Gerry G
While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. I thought I'd ask some experts. Any help guys?
Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette
The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac
Used SMT Equipment | SMT Equipment
Baking SMT on a cheap kitchen toaster oven is not difficult. You just need some patience and exploration good will. In this page you will read the manual procedure to bake SMD boards into a regular kitchen toaster oven appliance. Follows information
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Speedlines Camalot1818 Underfill Agilent SJ 50 AOI Universal GSM PTF Panasonic FCB-2M Flip Chip Bonder Speedlines MPM accuflex Solder Paste Printer DEK 265 GSX Solder Paste Printing Autolink Engineering PTE LTD R4200 Offl
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Technical Library | 2024-09-02 18:48:58.0
The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.
Full Automatic V-cut PCB Depaneler Introduction: This equipment can further improve the quality of depaneling. It can realize V-groove XY two-way automatic cutting, cutting aluminum & FR4 boards without burr, can connect the assembly line to realize
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Article Return to Front Page A Low Temperature Alte
Article Return to Front Page A Low Temperature Alte
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1.56 ug/cm2... Read More Ceramic CCA's and Aqueous Wash and Bake Out Prior to Parylene Coating QUESTION Question: I have a question concerning ceramic CCA and their bake out after aqueous wash cycle prior to parylene coating
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. Tight temperature control with a low DT was, of course, the primary requirement needed to manage the very limited process window and produce
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