Full Site - : bake time (Page 13 of 48)

Pre-bake times and temperature for polyimide boards

Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper

we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i

Boards delaminated after wash

Electronics Forum | Tue Aug 14 15:45:06 EDT 2001 | davef

BOARD BAKING SCHEDULE: Bake time depends on the board thickness and construction. For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. ROOT CAUSE OF THE PROBLEM: Heating moisture entrapped between the laminations of the board too quickl

PCB BAKING

Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef

IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components

MSD Baking

Electronics Forum | Fri Feb 10 13:30:31 EST 2023 | rwyman

Yes, that point remains unchanged. Just a general comment that there have been updates. e.g. re: desiccant re-use, certain devices no longer requiring bake-out, or bake times have been adjusted, and more.

Re: Bakeing

Electronics Forum | Mon Nov 27 17:39:37 EST 2000 | Dave F

Daniel: In response to your questions: * Moisture level (wt%) that may cause delamination in PCB�s. - Certainly, it depends, but 100% moisture will not cause delamination of a PCB. [Now, heating that water is another question, isn�t it? ;-)] *

Baking Desiccants For Reactivation

Electronics Forum | Fri Apr 15 14:43:52 EDT 2022 | djenkins62

Wanted to ask the SMT community if anyone has data on baking Clariant Desi Pak for 16 hours at 245 F. How are you cooling to avoid condensation reforming? Have you measured efficacy of desiccant after baked 10 times? 100 times 1000 times? 5000 t

Baking Fine Pitch Components

Electronics Forum | Mon May 13 20:40:07 EDT 2002 | davef

Fine pitch parts are not the issue. Platic parts that absorb moisture are the issue. Search the fine SMTnet Archives to get started. Try: * MSD * Moisture sentive device * Dessicant cabinets * Baking times * 033 * 020 * etc

Bake vs Dry Box

Electronics Forum | Mon Jul 29 16:52:51 EDT 2019 | stephendo

https://www.jedec.org/document_search?search_api_views_fulltext=j-std-033 You will have to register to download. It has the bake time charts. For BGAs at 40C we are talking days to weeks to months depending on thickness.

Pre-bake of Polyimide flex ? ?

Electronics Forum | Wed Jan 05 17:53:52 EST 2005 | SuePH

We had a contract in house that included a flex board which required an 18 hour bake at 105 degrees. The other brds got along fine with 2 hours, but the flex board would delaminate until we went to this long bake. I don't know how the engineer came

PCB Baking

Electronics Forum | Fri Feb 28 08:57:34 EST 2003 | davef

We used to bake [100*C for 6 hours] all of our boards, but no longer bake at all. Before going off, your bake recipe is probaly OK. If anything, it's probably too short. Consider measuring the weight of wet boards, baking for a time, measure, bake


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