Electronics Forum | Tue Oct 31 01:32:47 EST 2006 | hanocete
thanks for your reply, actually we bake the PCB assembly prior the rework because the package was exposed for quite some time already. The baking time was 24hrs @ 125 deg.C. We notice that there were flux residues on the connectors after the baking.
Electronics Forum | Wed Aug 07 08:46:38 EDT 2002 | davef
The time and temperature required for baking moisture from your boards varies according to the conflicting desires to: * Remove enough entrapped moisture. * Desire to retain solderability of solderable surfaces. Search the fine SMTnet archives for s
Electronics Forum | Fri Jul 11 13:04:13 EDT 2003 | fmonette
Hi Chris, Yes there is a limit to the bake cycles : "...the cumulative bake time at a temperature greater than 90C and up to 125C shall not exceed 48 hours. If the bake temprature is not greater than 90C, there is no limit on bake time..." Ref: J-S
Electronics Forum | Sat Jan 08 08:50:35 EST 2005 | davef
Normally, you should not have to bake boards that are properly packaged and stored. Since you are seeing problems, baking makes sense. Consider 125C for 4 to 6 hours. Additionally, look here for more, while waiting for others: http://www.smtnet.
Electronics Forum | Wed Jan 17 11:30:23 EST 2007 | Colleen Miller
We have some larger MSL3 parts that require baking. they are 6mm thick which takes them off the chart provided at http://www.jedec.org/download/search/jstd033a.pdf Does anyone have a reference that would tell me the baking times for these component
Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
Electronics Forum | Thu Oct 31 13:46:40 EDT 2019 | johnce
Hello, I have searched the forums for this specific topic, but can not find the clarification I would like. I am setting up a baking system to "reset" SMD components using a vacuum-bake oven. According to the JEDEC-STD-033 standard, depending on th
Electronics Forum | Thu May 06 08:29:41 EDT 2004 | Christopher Lampron
10% RH) Do these stored components need baking before I use them now or not? * Depends on the MSD level (should be marked on packaging) Level 6 component need to be baked prior to asembly no matter what. Other levels should be OK if they were store
Electronics Forum | Sat Mar 06 22:50:48 EST 2004 | pari
Hi, can somebody please educate 1. What is the baking temperature and time before reworking a faulty board that is received from the field. 2. What specs that specifys this baking temp and time? Thanks
Electronics Forum | Mon Mar 08 22:04:19 EST 2004 | pari
Dave i know abt the JEDEC033A specs..but this question is more of PCBA level. The baking temp and time at JEDEC is for MSD devices. I have tried to check IPC 7711 but the criteria does not mention the baking temp and time. Wandering is anyone is awar
