Electronics Forum | Thu Mar 16 22:19:38 EDT 2017 | deanm
First, reflow does not reset the clock for MSL exposure. The best solution is to run the second side before the exposure time expires. I am curious to know why they must sit for 40 hours. If that cannot be done, then store the assemblies in a dry c
Electronics Forum | Thu Sep 15 17:44:15 EDT 2022 | decaire
I agree with Evtimov that sticking with the J-Std-033 is preferable to creating your own procedure at a different temp, especially if you need to pass an audit since the auditors will compare your process to the J-Std. My understanding is that oxida
Electronics Forum | Thu Apr 01 12:44:06 EST 2004 | Chris Lampron
Laxman, JEDEC J-STD-033A has a bake time/temp table based on different package thicknes.
Electronics Forum | Wed Apr 04 16:54:58 EDT 2007 | pjc
Maybe more baking time is needed. Topside board temp too low. Moisture trapped in board. Top of through hole capped by component and trapping flux. http://www.speedlinetech.com/electrovert/electrovert-troubleshooting/index.htm
Electronics Forum | Mon Jul 15 15:02:55 EDT 2013 | island2013
In previous lives we vacuum sealed all MSD devices. Also a nitrogen chamber can be used for unsealed bags. You can check the J-STD-033 and J-STD-020A for handling of the different levels, bake times etc. Good Luck!
Electronics Forum | Fri Nov 19 11:07:17 EST 1999 | Bob Smith
Hi John, I don't know of any posters etc. but specs. are available free on-line at www.jedec.com for classification, time out of packaging before baking is required, bake times & temperatures. My understanding is that it only causes a problem if th
Electronics Forum | Mon Nov 20 06:51:00 EST 2000 | Daniel Carlsson
Does anyone have information regarding: -Moisture level (wt%) that may cause delamination in PCB�s. -Baking time and temperature if using a Vacuum Drying Cabinett and if using an air oven. (What I�m most interested of is Poly-Imid-Aramid.) -Are ther
Electronics Forum | Mon Aug 05 03:03:50 EDT 2002 | jkhiew
Hi all, I had some old stock of CEM1 pcb: a. How long & under what temp. condition shall I bake it to eliminate the trapped moisture ? b. Is the baking time & temp. different for 3 yrs old stock, 2yrs old stock & 6 month old stock ? c. For CEM1 pcb,
Electronics Forum | Mon Mar 22 07:35:41 EST 2004 | Chris Lampron
We too are baking required components at 125 degrees C. One of the problems that is comming up is components packaged in tubes. The tubes cannot stand the 125 degree requirement without melting. 50 degrees is a safe temperature for low temp carriers
Electronics Forum | Sat Feb 02 08:19:40 EST 2008 | davef
Operator: use http://www.jedec.org/DOWNLOAD/search/jstd033b.pdf BillG: Sometimes, the recommended bake times are numbingly long, because the authors of J-STD-033 assumed that: * Component took-on a large amount of moisture * You want your component
