Electronics Forum | Tue Feb 20 16:33:08 EST 2001 | davef
Time, time, time. There just never seems to be enough!!! Eh? You�re correct. Depending on the material, some trays can take a high temperature bake, while other trays, in addition to tubes, and reels, require a low temperature bake. With this la
Electronics Forum | Sun Jan 19 10:45:04 EST 2003 | davef
For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. [Search for other bake recipes in the fine SMTnet Archives.] Alot of the determination of baking time is a function of: * Amount of moisture absorbed. * Amount of moisture you need to r
Electronics Forum | Tue Jun 06 05:26:04 EDT 2000 | Jacqueline Coia
Hi There, Could someone please point me in the right direction in the subject of baking 'metal' packaged BGAs before rework. What are recommended baking temp. & time. Much appreciated. Jack
Electronics Forum | Tue Jul 16 01:12:31 EDT 2002 | ppcbs
We find that baking PCB assemblies at 90 degrees C in a Blue M forced air oven is safe for most all PCB's that we have encountered over the past 12 years. We remove any external plactic hardware that may be attached to the assembly and also like to
Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas
The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme
Electronics Forum | Tue Jun 13 23:08:32 EDT 2006 | mrduckmann2000
WINSLOW IS NOT THE BEST CHOICE, WE HAVE TRIED SEVERAL DIFFERNET STYLES OF BGA'S WITH NO LUCK. WINSLOW HAS EVEN HAD TROUBLE RE-BALLING OUR BGA'S. THEY SUGGEST LONG BAKE TIMES, DIFFERENT FLUXES...ETC NOTHING HAS WORKED PERFECTLY. THE PREFORMS ARE B
Electronics Forum | Fri Dec 17 02:43:24 EST 2010 | grahamcooper22
Ideal storage conditions to stop pcbs absorbing moisture is at less then 5% RH, for example in sealed moisture barrier bags. You mention that storage was at 40~70%...at these levels the pcb will absorb quite a bit of moisture. Your baking time was no
Electronics Forum | Mon Jun 13 12:58:10 EDT 2011 | deanm
We find it is a bigger issue in the summer when there is more humidity in the air even though our facility is air conditioned. We've also seen similar boards go through the same process and vendor A has problems and vendor B doesn't, so fabrication t
Electronics Forum | Thu Aug 30 09:56:16 EDT 2007 | blnorman
According to J-STD-033 Table 4-1, the bake out time to restore the clock to zero is not only determined by the MSL level, but the package thickness as well. Section 4.2.2 states "SMD packages shipped in low temperature carriers may not be baked in t
Electronics Forum | Sat Nov 22 09:27:18 EST 2008 | davef
IPC-HDBK-001 w/Amendment 1 Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001B to C Comparison). During fabrication and storage, both components and PWBs will often absorb water. If left in the device, this water will vaporize at solderi
