Electronics Forum | Wed Jun 24 18:50:31 EDT 2020 | premkumar_haribabu
Dear experts, We are in stage to fix lapse or hold time between pre-bake to reflow process ( SMT ) for flex-rigid PCB, usually for flex pcb , we need to assemble as early as possible once after baking & if not , we can store in humidifier up to some
Electronics Forum | Tue Jan 18 12:41:14 EST 2005 | paulom
I am having some problems with regard to soldering of PBGAs. In the factory had high humidity. Can I make Bake in different temperatures of 125 and 40 degrees? Which the minimum temperature? How many times I can effect bake without damaging the com
Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef
Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe
Electronics Forum | Wed Jul 11 22:48:54 EDT 2012 | joeion
It is correct to remove moisture in PCB by baking. But I think the time and temperature is too little. According to our experience, it should be more than 60min at 120 centigrade degrees.
Electronics Forum | Mon Jan 04 21:03:22 EST 2010 | cman
1) I'm not familiar with the acronym CAF. Could you spell that one out for me? 2)Why do you feel they need to be baked? Are they in a high humidity enviornment? the only time we bake is when we are dealing with moisture sensitive components. Do you b
Electronics Forum | Mon Jan 07 13:09:35 EST 2008 | stevek
As I told you, some carriers (trays) are limited > to 75 degree maximum, and from time to time > employees do not pay attention to this. This is > one of the reasons. The second reason is that 90 > degree still be problematic in a case of rebake
Electronics Forum | Mon Dec 01 14:51:55 EST 2014 | jpal
We had the same problem too. Water would remain under the caps even after a bake out. We saw this numerous times when the caps were removed after the wash and bake. The only fix was to hand solder the large electrolytics.
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F
| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so
Electronics Forum | Wed Oct 14 04:01:28 EDT 1998 | Joakim Fagerlund
We have problems with achiveing a void free soldered joint when we seal different kind of packages (QFP,LCC and PGA) We think the problem partly is due to outgasing from the die-adhesive (silver-glass) Does anybody have any reccomendations what to d
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