Electronics Forum | Thu May 21 16:26:29 EDT 1998 | Earl Moon
| Does anyone know about low pressure/low temperature | ovens used for baking of moisture senstive | components? | Thanks I need to know from where your need came. I usually just bake in conventional ovens with specified times and temperatures. Ple
Electronics Forum | Wed Nov 29 01:46:10 EST 2006 | hanocete
Hi! to all, Here in our company, we sometimes received BGAs and ICs that were packed poorly(not sealed), and no MSL level written to it from our suppliers, now we subject the material for baking before using it. We use J-STD-033B table 4-1 as our cr
Electronics Forum | Mon Jun 25 20:32:44 EDT 2001 | davef
You�re correct. This is a messy situation. Do not store components at the bake temperature longer than the time required to dry out the units for use in the reflow. Long storage times at elevated temperatures can cause soldering problems and the
Electronics Forum | Fri Feb 02 05:11:29 EST 2018 | deanm
I developed our company's procedure for moisture sensitive devices based on J-STD-033 and I don't recall anything requiring a certain ramp rate. Furthermore baking at 85C will greatly extend the time to reset the clock and it is harder to maintain
Electronics Forum | Thu Apr 14 17:24:06 EDT 2022 | cbart
depends on board finish and PCB substrate materials. If you were using OSP or silver finished bare boards the time to process is less than an ENIG or HASL finished. certain substrate material absorb more moisture than others or at a quicker rate. so
Electronics Forum | Fri Jun 18 12:11:20 EDT 1999 | John Thorup
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
Electronics Forum | Tue May 05 15:45:37 EDT 1998 | Dave F
| Looking to buy used or new tubes, that will fit an SOIC-16 | Need these tubes ASAP. We need to bake these parts and drypack. | Please email or call if you can help. | Eric Jenkins | 801 956-0897 Eric I'm not sure of the manufacturer of the parts th
Electronics Forum | Thu Oct 27 11:45:06 EDT 2005 | Jeffm
I have a multi layer (8) PWB with blind vias going from 1 to 7 that is experiencing occasional blistering (delam). It is only on perhaps 15% of the boards run. We vacuum baked (85C, not sure what pressure) a sample lot and still had a few exhibit the
Electronics Forum | Tue May 26 07:46:26 EDT 1998 | Peter H. Cote
We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
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