Electronics Forum | Tue Jul 18 00:15:37 EDT 2023 | hazira1991
Is a fresh lot. This bga is old date code 2010. we had received this BGA 2021 and the baking process is done during receiving time. Production received with vacuum seal , its very hard to tell how the BGA handling and stuff and the BGA already EOL. I
Electronics Forum | Wed May 05 14:37:58 EDT 2004 | Gaz
I'm not in production, but I do repairs by replacing CSP & LGA components on PCB's. Our components are supplied sealed in packs of 5 with a humidity indicator card and desiccant. I recently failed an audit by the company I do the work for because th
Electronics Forum | Fri May 22 11:12:25 EDT 1998 | Mike Glenn
| | Does anyone know about low pressure/low temperature | | ovens used for baking of moisture senstive | | components? | | Thanks | I need to know from where your need came. I usually just bake in conventional ovens with specified times and tempera
Electronics Forum | Fri Aug 16 11:13:17 EDT 2002 | kenbliss
I have a question for everyone about component baking. In my view this is rework. The component was manufactured and shipped correctly and should not need baking in order to use it. Some how in storing the component in a stockroom atmosphere (I as
Electronics Forum | Mon Dec 16 15:10:56 EST 2002 | Randy Villeneuve
We do not bake any of our boards prior to wave solder. If we did we would have one heck of a large oven. I would assume you are concerned about moisture sensitive components. In most cases your top side parts should only get to 80 degrees centigarde
Electronics Forum | Fri Apr 15 13:39:43 EDT 2022 | emeto
Bake a board. Measure weight. Measure board weight that haven't been baked.
Electronics Forum | Wed Jan 23 18:15:33 EST 2008 | gsala
Hi, are you dealing with Leaded or Lead Free P-BGA ? soldering by Lead or Lead Free paste ? Any way, some time, bridges can be caused by moisture entrapped in the BGA body. Make sure if is respected the correct MSL's allowed flore exposure time, ot
Electronics Forum | Tue May 26 14:42:55 EDT 1998 | Justin Medernach
| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.
Electronics Forum | Tue Jun 09 18:44:20 EDT 2009 | dyoungquist
We are using a water soluble flux which requires the assemblies to be cleaned in an ultra sonic cleaner after assembly. Is there a standard that specifies how long the assemblies need to be baked/dried after being submersed in a water solution for a
Electronics Forum | Fri Jul 06 05:28:59 EDT 2012 | jsolloway
..... that's very strange. If there were any risk of de-lamination then it would of occurred during the reflow process, surely. Unless the through hole department are using heat guns or wave sodler? I doubt if the sales or planning team are happy if
