Electronics Forum | Thu May 12 10:49:27 EDT 2016 | Bill Albright
If an electronic component with a MSL rating of 1 is exposed to an moist environment greater than the 85% relative humidity to the point where the packaging is wet, what is the risk level of using the device in a lead-free soldering reflow process?
Electronics Forum | Mon Jan 10 16:14:17 EST 2005 | fmonette
Hi Gary, With plastic BGAs it is more difficult to remove the trapped moisture because of ground planes in the substrate. If your parts have been sitting around for a long time they may be soaked with moisture and in some cases the 48 hours bake cy
Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Fri Nov 14 09:51:43 EST 2014 | jpal
Rock can contain a little bit of moisture. Bake the rocks for a long time before placing them in solder so they don't explode. The glass marbles may be the safest idea. Or start heating the tank with the solid mass already in there. Did I just write
Electronics Forum | Fri Jan 05 20:12:22 EST 2007 | engr
I am using PWB material Rogers 6002 High Frequency Laminate. The PWBs are assembled. They were washed and will require a bake out. Some people say, no bake out is required for the material. I am getting different reads in test if the CCAs are not
Electronics Forum | Fri Dec 18 12:45:23 EST 2015 | deanm
Using a vapor degreaser with a solvent such as Vertrel, Novec, Techspray 1655, Solstice, etc. may work for you but solvents can attack certain plastics. Should be fine for SMT though. This is assuming you are using a no-clean (RMA) type flux, not wat
Electronics Forum | Tue Sep 07 17:12:34 EDT 2004 | davef
No one knows what type of board you use. So, assuming you're talking a fairly standard FR4. Q1a. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? A1a. We'd guess your board could take 250*C for may
Electronics Forum | Tue May 26 15:49:05 EDT 1998 | Earl Moon
| | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg
Electronics Forum | Tue Apr 13 14:49:15 EDT 2010 | davef
90%) from the sample, and the bake time and temperature specified herein are minimums. To improve test accuracy, or to prevent heat damage, other bake parameters may be AABUS. 2 Applicable Documents IPC-QL-653 Certification of Facilities that Inspect
Electronics Forum | Mon May 27 18:25:03 EDT 2002 | Carol Stirling
Thanks for the information Reworkman, We are leaning to the theory of better safe than sorry. I think I'd supply the bags and dessicant just to eliminate manufacturing issues. What temps & times do you ask your boardhouse to bake to? Ours said some
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