Electronics Forum | Mon Mar 31 01:20:42 EST 2003 | Bryan Sheh
I agree that we should bake the pcb at higher temp and for longer time.for example...95--115c for at least 4 hours. also,keep the temp from 150--170c ,60-90 seconds while preheating. completely keep the moisture and volitales out of pcb and solder pa
Electronics Forum | Fri Apr 21 08:07:10 EDT 2006 | amol_kane
I struggled with the std too, when trying to justify the need for a desiccant cabinet. according to my interpretation: 1. the components are baked at 125 or 150 dec C within 24 hrs of manufacture (this is MET) and sealed in the MBBs at the component
Electronics Forum | Fri Oct 23 12:38:34 EDT 2009 | kircchoffs
--the lead time for ENIG only 6 monnths and need do baking before use if those boards was expired. speaking of baking. what is the correct procedure? may i know the temps,time and profile? thanks
Electronics Forum | Thu Jun 11 10:02:36 EDT 2009 | dyoungquist
Our cleaning process involves the assemblies being completely immersed in the water bath of the ultrasonic cleaner. The assembly has a QFP44 on it. Customer stated that when these assemblies have been cleaned with water in the past (at a different
Electronics Forum | Sat Dec 13 17:46:27 EST 2008 | ysutariya
If you're military then you're probably just needing standard 130Tg FR4 and tin-lead finish. I would check two things: 1. Bake temperature: Isola recommends 300F for 4 hours to drive moisture out. Lower baking temperatures do not require a linea
Electronics Forum | Fri May 22 13:20:33 EDT 1998 | Earl Moon
| | | Does anyone know about low pressure/low temperature | | | ovens used for baking of moisture senstive | | | components? | | | Thanks | | I need to know from where your need came. I usually just bake in conventional ovens with specified times a
Electronics Forum | Tue Jun 17 09:00:58 EDT 2003 | fmonette
Good question, here is the short answer : The problem is that dry storage is not the same as a bake process. If you want to bake saturated components, this should be done at higher temperatures. The IPC/JEDEC standard provides a table with bake temp
Electronics Forum | Tue May 26 11:11:59 EDT 1998 | Steve Gregory
Hi Peter, There's been a lot of discussion on this topic lately (baking parts), and that got me reading the IPC-SM-786A, which is pretty good. For your first question, the parts absorb moisture over time. The type of package mold compound
Electronics Forum | Fri Oct 01 09:32:25 EDT 2010 | mazjal7
Rob, thank you for input. I notice you mention a baking process for the flex circuits, this is our first time with flex assembly, do the flex circuits need to be baked prior SMT, Moisture? Thanks, David
Electronics Forum | Mon Sep 03 06:01:21 EDT 2012 | amitsindwani
Should a baking oven be allowed to be kept off with MSDs kept inside ? Will it attract moisture back after a certain time period ?
.jpg)
