Electronics Forum | Fri Nov 21 09:29:11 EST 2008 | saintete1304
Hi , i desire to find the type of information : When the Soldering must be performed after baking for the PWB to not have a POP problem link to the moisture ? And the time for a flexible PWB ? thanks best regards
Electronics Forum | Fri May 01 09:53:24 EDT 2009 | kevslatvin
APS/Novastar usually bakes cookies in thier ovens at trade shows. At least both times I've been to Apex they had cookies going through one of thier ovens. Granted these were new ovens with no PCBs through them yet. Made good cookies though.
Electronics Forum | Fri Jun 01 04:05:25 EDT 2012 | grahamcooper22
If you think the root cause is excess moisture in the pcb then try to bake it for longer. Even longer then the manufacturers recommendation. It takes a long time for excess moisture to come out of a pcb. Try 24 hours , then 36 hours and see if there
Electronics Forum | Wed May 03 16:37:10 EDT 2017 | charliedci
I don't believe there should be any issues with the HASL finish. The issue is how long on the shelf and is a bake out required to remove moisture from PCB, as in any FR4 PCB's that may have had time to absorb moisture.
Electronics Forum | Tue Apr 19 17:34:34 EDT 2022 | dwl
Be careful of MSL level 4 or higher devices on the first side. if they sit out 3 days, they will need to be baked before second side reflow or you risk component damage.
Electronics Forum | Tue Feb 20 04:18:39 EST 2001 | chinaman
Hi everyone if once the exposure time is exceeded the only option is to bake the components. I learned there is an "old spec" for the baking conditions (24h/125C or 192h/40C) and a "new spec" which is the current standard specifying conditions of 4
Electronics Forum | Thu Jun 20 04:53:13 EDT 2002 | hany_khoga
Thanks Dave but unluckily my sweet BGA�s are surrounded by plastic connectors with hundreds of pins. Also my PCB�s are 4-layers so just thinking of doing what you suggest means ruining them for me. To be honest I tried bypassing the baking issue bef
Electronics Forum | Mon Jul 19 21:33:26 EDT 2004 | davef
Are you talking about small 'volcanos' that burst through PTH solder connections? If so, you have moisture outgassing through the PTH barrels: * Plating on the hole of your bare board is too thin. It should be greater than 1 thou [25um]. * Your bak
Electronics Forum | Thu May 15 15:02:03 EDT 2008 | ccross
We have seen this problem before. We have ALWAYS found it to be a board vendor issue. Also, we tend to see it more during the summer months. Our solution has been to bake our PCBs @ 50 deg C for 1 hr prior to use. We use immersion white tin board fin
Electronics Forum | Wed Jan 09 01:22:39 EST 2019 | kenneth0
Hi Simond, The baking process is likely to remove any moisture after the cleaning process. We wouldn't want any moisture trapped as this might cause delamination if the package is subject to subsequent heating/reflow process. Hence there's a staging
