Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver
Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol
Electronics Forum | Wed Feb 21 14:18:37 EST 2001 | jagman
Could anyone please give me some insight on the time/temperature requirements for curing SMT adhesive used for a high temperature (96/4 solder) application in a bake oven, rather than using reflow? I understand that it would probably vary from epoxy
Electronics Forum | Wed Jan 03 16:52:19 EST 2007 | Pete
What is a foolproof means of eliminating moisture content from Printed Circuits that arrive (bot hpurchased and consigned) in unsealed, non-dessicant packed bags? Als, is there a procedure for basic mass of boards vs. temp/cure times? I need to min
Electronics Forum | Fri Jul 30 14:53:01 EDT 1999 | Tom B.
Hello Netters, I have a customer who wants us to aquaeos wash a PCB after all operations have been performed. The PWB is two layer FR4 with a Transformer, a Multichip Module with Conformal Coating, (6) 11" insulated wires that are tinned on exposed
Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup
| | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very mo
Electronics Forum | Mon May 27 12:24:21 EDT 2002 | arcandspark
Carol, I beleive there is an IPC spec for Moisture control. We see all kinds of problems with boards coming from the vendors. We use to bake all bare fabs upon recieving them. This helped alot but waste time. We now rely on the board vendors to bake
Electronics Forum | Wed Jun 18 13:08:52 EDT 2008 | sleech
Dave: You are spot-on right! The major hurdle is that 70 degrees C is below the boiling temperature of water. Only a near zero relative hudity chamber will cause the ingested moisture to migrate from a package. There is one facet of the 70 degree p
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Mon Jun 13 07:20:10 EDT 2011 | scottp
It's more likely the warp is due to material issues. I've spent way more time than I'd care to admit running Thermoire with various profiles and there's pretty much nothing you can do to reduce warp via profile unless your current profile is truly a
Electronics Forum | Sat Aug 21 14:35:28 EDT 1999 | Stu Leech
| | | | | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does lar
