Electronics Forum | Mon May 18 21:29:38 EDT 1998 | D.Lange
| I've tried every thing I can think of. Do you have any | Ideas? | What I have is micro balls on the gold fingers of | panelize boards. These balls only appear on the gold | finger. Or at least I can only find them on the gold | fingers. | What I
Electronics Forum | Thu Aug 19 14:06:07 EDT 1999 | Stu Leech
| | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large sca
Electronics Forum | Thu Aug 19 14:52:13 EDT 1999 | John Thorup
| | | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large s
Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette
Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i
Electronics Forum | Fri Jun 18 06:54:43 EDT 1999 | Paul McMichael
A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for popc
Electronics Forum | Fri Jun 18 13:30:01 EDT 1999 | John Thorup
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
Electronics Forum | Mon May 15 12:36:12 EDT 2017 | edhare
I don't believe there should be any issues with > the HASL finish. The issue is how long on the > shelf and is a bake out required to remove > moisture from PCB, as in any FR4 PCB's that may > have had time to absorb moisture. > I don't believe
Electronics Forum | Fri Feb 25 10:23:46 EST 2000 | K3 Equipment
Greg, If you are having a problem, i would first check board manufacturers process. Also are they shipping boards to you in seal packages (a must if you are in a humid part of the country.) Most of the time with a few simple process controls moistur
Electronics Forum | Fri Feb 25 10:23:46 EST 2000 | K3 Equipment
Greg, If you are having a problem, i would first check board manufacturers process. Also are they shipping boards to you in seal packages (a must if you are in a humid part of the country.) Most of the time with a few simple process controls moistur
Electronics Forum | Wed Jun 20 18:21:33 EDT 2001 | davep
What experience does anyone have with a MS level 6 SMT component? I have a part that must go from component baking to reflow within six hours. According to the component mfg, a sealed MS bag w/ desicant is not sufficient protection to increase the
