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Vertical Drying Oven Series Video

Vertical Drying Oven Series Video

Videos

Versatile, affordable drying system suited to a number of applications like PCB baking & drying. To get more information from below link: http://www.1clicksmt.com/products/baking-dry-cabinets.html

1 CLICK SMT TECHNOLOGY CO., Limited

Vitronics XPM2 REFLOW OVEN

Vitronics XPM2 REFLOW OVEN

Used SMT Equipment | Soldering - Reflow

MULTIPLE VITRONICS REFLOW OVENS AVAILABLE WWW.XLINEASSETS.COM - AUCTION ITEMS JABIL LIQUIDATION Featured Equipment: St. Petersburg, FL Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18

X-Line Asset Management

Fuji CP 642 and CP65

Fuji CP 642 and CP65

Used SMT Equipment | Pick and Place/Feeders

Multiple Fuji CP Chipshooters Available. www.xlineassets.com   AUCTION ITEMS Jabil Liquidation Including Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18 Rework System Flexlink Transfer C

X-Line Asset Management

Universal Instruments Universal Genesis Pick and Place Systems (2)

Universal Instruments Universal Genesis Pick and Place Systems (2)

Used SMT Equipment | Pick and Place/Feeders

Universal Genesis Pick and Place Systems www.xlineassets.com - AUCTION ITEMS JABIL LIQUIDATION Featured Equipment: St. Petersburg, FL Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18 R

X-Line Asset Management

Racks - Model 80-18-18

Racks - Model 80-18-18

New Equipment |  

MODEL 80 - For medium to large boards Overall Dimensions: L: 476 W: 508 D: 457 mm Board Capacity: W: 457 D: 457 mm - Standard card guides are 317,5 mm deep, optional 457 mm guides for very large boards. - 75 numbered slots measure 2,8 x 3,9 mm on a 5

OLREIN GmbH

Multitest's UltraFlat™ Process Meets Requirements of High Parallel Vertical Probe Card Applications

Industry News | 2012-01-05 19:20:11.0

Multitest announces that its UltraFlat™ process meets the requirements of high parallel vertical probe card applications.

Multitest Elektronische Systeme GmbH

Solder beading with PCB from different fab

Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid

TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s

Re: Oven vs. Dryer

Electronics Forum | Mon Dec 07 12:33:03 EST 1998 | Jeff Sanchez

| There are significant differences in a properly designed dryer vs. an Oven. Ovens mearly bake the moisture from assemblies. The high humidity of a drying environment was not considered when most reflow ovens were designed. Dryers are designed wit

Oven vs. Dryer

Electronics Forum | Sun Dec 06 13:18:12 EST 1998 | S. Evers

There are significant differences in a properly designed dryer vs. an Oven. Ovens mearly bake the moisture from assemblies. The high humidity of a drying environment was not considered when most reflow ovens were designed. Dryers are designed with

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