Versatile, affordable drying system suited to a number of applications like PCB baking & drying. To get more information from below link: http://www.1clicksmt.com/products/baking-dry-cabinets.html
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Conductive Foil Tapes Our range of conductive foil tape offers a cost-effective solution to EMC shielding. Tapes are available in both copper and aluminium with a conductive adhesive. The tapes can be used to seal joints on enclosures and for ground
Used SMT Equipment | Soldering - Reflow
Despatch TDF2-52-1E Bake Oven Brand: DespatchModel: TFD2-52-1ESerial number: 194309Max Operating Temperature: 343C (650F)F.A. DUCT 7.00" DIAEXH. DUCT: 2.50" x 13.5"F.A. Damper Blade Cut to: 1.38" DIA Holes 2XEXH. Damper Blade Cut to: 11.25LGMinimum p
T40W-1200-6 is a plug and play, fully auto dry cabinet which will be stable at 40C and 15C. Fresh News We will participate Productronica 2015 show. The world’s leading trade fair for electronics development and production. http://www.productroni
EcoTech distributes new and reprocessed plastic IC trays for use in the testing, baking, handling and shipping of Surface Moount ICs.
Tape & Reel, Lead Inspection, Lead Repair, Moisture Bake. Vacuum Seal, Qa Inspection services for the IC Manufactures, Contract Manufactures and Distributer. Based in the Heart Silicon Valley.
A contract printer offering pad printing, laser marking & demarking, surface reconditioning, ink marking, barcodes, serialization, bake and dry pack, plasma and other cleaning processes and screen printing technologies for the electronics industry.
IDC is the developer of a low temperature baking process for removing moisture from moisture sensative package, while they remain in either tape or tubes. It is currently engineering equipment to support the process.
Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
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