SJ101 Sintered Welding Flux Specification:GB/T 12470-2003�� ���������� F48A4-H08MnA; F55A4-H10Mn2 Equal to: AWS A5.17-97; AWS A5.23-97 F7A4-EH14; F8A4-EA2-A2 ����Description: SJ101 flux is a kind of fluorine-basic sin
Electrical devices such as motors, generators, and transformers function on the basis of electromagnetic induction. The rotational or linear movement of such electrical rotary equipment is caused by electromagnetic fields, generated by electrical coi
Industry News | 2018-09-23 09:54:24.0
The industry’s leading manufacturer of critical cleaning, coating and lubrication products, MicroCare Corp. has extended its portfolio even further with the launch of new and progressive products which will be showcased at this year’s SMTA International in Chicago, Illinois, USA from 14 – 18th October, which includes a new series of flux remover pens.
Industry News | 2011-10-07 23:12:37.0
Seika Machinery announces that Michelle Ogihara, Senior Sales Director, will co-chair the Moisture Sensitive Device (MSD) Council meeting during the upcoming SMTA International Conference & Exhibition
Industry News | 2011-12-12 19:11:19.0
Seika Machinery announces its year-end special on high-quality, reasonably-priced products.
Industry News | 2012-01-05 19:20:11.0
Multitest announces that its UltraFlat™ process meets the requirements of high parallel vertical probe card applications.
Industry News | 2012-05-31 14:49:02.0
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
Industry News | 2012-11-05 14:21:13.0
ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit
Industry News | 2013-05-16 11:14:05.0
Seika Machinery, Inc., announces its Spring discount sale on McDry Ultra-Low Humidity Storage Cabinets, effective through May 31, 2013.
