Electronics Forum | Fri Apr 03 02:52:42 EST 1998 | Jacqueline Coia
At this moment in time we are using water soluble solder paste on our PCBs these are cleaned using water only, agitated with ultrasonics. After drying a white/grey residue is left around solder joints. Reflow profile is fine and a reliable wash proce
Electronics Forum | Wed Aug 02 21:36:14 EDT 2006 | Chunks
It depends on the water quality of your final rinse too. Too dirty and pools of water will trap residues on your board. If let to evaporate, these residues can stay on your board.
Electronics Forum | Thu Aug 03 16:42:48 EDT 2006 | Merle
The cleaner does have a dryer, but does not remove all moisture - we can see that. It is functioning - we can see that too.
Electronics Forum | Thu Aug 03 18:35:45 EDT 2006 | russ
So what are your current drying parameters? can you adjust temp and time? is this a batch cleaner that may have some shadowing from the way it is loaded causing hot air to not hit certain boards? Russ
Electronics Forum | Tue Aug 14 17:09:37 EDT 2001 | davef
Dano's confused. The boards are delaminating during soldering. The delamination just isn't immediately appartent after soldering. Stepping backwards. It's remotely possible that if the boards were blistering hot from soldering and then dumped in
Electronics Forum | Wed Aug 02 17:39:54 EDT 2006 | russ
Well i guess you would not have to dry the boards but let me ask this, Are you hand cleaning water soluble flux in a sink? Never seen a cleaner without a dryer. Anyway temp and time for drying is easy to figure out. When boards are dry you have i
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c
Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii
J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if
Electronics Forum | Thu Jul 12 02:15:53 EDT 2012 | thmeier
Check also the specs / recommendations of your PCB manufacturer. We bake boards 4h/120°C before reflow and after automated cleaning (it´s not FR4!) and also if we have to rework with the autometd rework- stations (massive IR underheating ,..). Regar
Electronics Forum | Wed Jul 11 22:48:54 EDT 2012 | joeion
It is correct to remove moisture in PCB by baking. But I think the time and temperature is too little. According to our experience, it should be more than 60min at 120 centigrade degrees.
