Industry Directory: baking and msl (2)

SemiPack Services INC

Industry Directory | Consultant / Service Provider / Manufacturer

SemiPack Services is an Electronic Manufacturing Support Service to the semiconductor industry. We specialize in providing support services to high-mix low-volume (HMLV) customers

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

New SMT Equipment: baking and msl (6)

Baking Dry Cabinet for storage of SMD, PCB, IC, comply with JEDEC033C(T40W-1200-6 Auto baking cabinet, 40C and 5%RH)

Baking Dry Cabinet for storage of SMD, PCB, IC, comply with JEDEC033C(T40W-1200-6 Auto baking cabinet, 40C and 5%RH)

New Equipment | Other

T40W-1200-6 is a plug and play, fully auto dry cabinet which will be stable at 40C and 15C. Fresh News We will participate Productronica 2015 show. The world’s leading trade fair for electronics development and production. http://www.productroni

Ace Dragon Corp.

Electronics Forum: baking and msl (106)

BGA baking

Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman

If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory

Moisture Sensitive part - baking

Electronics Forum | Fri Aug 24 12:20:41 EDT 2007 | petep

I have an MSL3 part (a relay) supplied in tape and reel. From what I am able to determine, these parts require baking at 257 degrees F for a minimum of 8 hours once the integrity of the seal is broken for over 168 hours. How are parts baked at th

Used SMT Equipment: baking and msl (2)

Fuji CP 642 and CP65

Fuji CP 642 and CP65

Used SMT Equipment | Pick and Place/Feeders

Multiple Fuji CP Chipshooters Available. www.xlineassets.com   AUCTION ITEMS Jabil Liquidation Including Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18 Rework System Flexlink Transfer C

X-Line Asset Management

Universal Instruments Universal Genesis Pick and Place Systems (2)

Universal Instruments Universal Genesis Pick and Place Systems (2)

Used SMT Equipment | Pick and Place/Feeders

Universal Genesis Pick and Place Systems www.xlineassets.com - AUCTION ITEMS JABIL LIQUIDATION Featured Equipment: St. Petersburg, FL Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18 R

X-Line Asset Management

Industry News: baking and msl (25)

SMTA Certification Programs in Minnesota and Boston

Industry News | 2003-04-21 09:11:21.0

One for SMT Processes and one for SMT Systems

Surface Mount Technology Association (SMTA)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: baking and msl (1)

Juki Pick and Place Machine SMT Feeder Parts JUKI FEEDER UPPER COVER 5632 E82037060AB

Juki Pick and Place Machine SMT Feeder Parts JUKI FEEDER UPPER COVER 5632 E82037060AB

Parts & Supplies | Assembly Accessories

Pick and Place Machine JUKI FEEDER UPPER COVER 5632 E82037060AB Specifications:  Brand Name JUKI FEEDER UPPER COVER  Part number E82037060AB  Model FF56FS  Ensure Test in machine before shipping  Guarantee Original 100% Supply all juki spare

KingFei SMT Tech

Technical Library: baking and msl (2)

Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour

Technical Library | 2018-09-21 10:12:53.0

Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.

National Physical Laboratory

Handling of Highly-Moisture Sensitive Components - An Analysis of Low-Humidity Containment and Baking Schedules

Technical Library | 2022-09-12 14:07:47.0

Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.

Alcatel-Lucent

Videos: baking and msl (1)

Resin plug application and process

Videos

With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr

Headpcb

Express Newsletter: baking and msl (30)

Partner Websites: baking and msl (42)

Ceramic CCA's and Aqueous Wash and Bake Out Prior to Parylene Coating - EPTAC - Train. Work Smarter.

| https://www.eptac.com/faqs/ask-helena-leo/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating

Ceramic CCA's and Aqueous Wash and Bake Out Prior to Parylene Coating - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more


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Circuit Board, PCB Assembly & electronics manufacturing service provider

Best Reflow Oven
Circuit Board, PCB Assembly & electronics manufacturing service provider

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