If you require quality automation with warranties up to 5 years, or wish to sell machines give us a call (517) 521-2020 or email at 4TechUSA.com We are here to help ! Universal Instruments Model GSMX Precision placement system with the High force
ScanPLACE provides a sophisticated and user-friendly alternative to complex CAM software packages and inaccurate, time consuming manual inspection and programming methods that cost assembly houses productivity, time and money. Programming Using a
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Used SMT Equipment | Soldering - Reflow
Vitronics XPM2-1030 Lead-Free Reflow Oven Multiple Units Available. Factory Closure - www.xlineassets.com SMT Line #1 2006 MPM Speedline Accela Screen Printer 2007 Universal Advantis AC-30 4983A 2007 Universal Advantis AC-30 4983A 2016 Bro
Industry Directory | Manufacturer
Data I/O is the world's leading provider of manual and automated programming solutions for semiconductor (IC) devices. Data I/O's solutions, software and programming engine ensures devices are programmed correctly every time.
Technical Library | 2014-08-14 17:58:41.0
High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic. This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown.
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
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Parts & Supplies | SMT Equipment
Panasonic AI Parts N210056710AA Outside Moving Blade Our company is professional Supplier & Manufacturer of SMT(Surface Mount Technology） Spare Parts ,if you have any needs,please contact us in these ways: ZK Electronic Technology Co., Limit
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Parts & Supplies | SMT Equipment
Panasonic AI Parts N210056711AA Inside Moving Blade Our company is professional Supplier & Manufacturer of SMT(Surface Mount Technology） Spare Parts ,if you have any needs,please contact us in these ways: ZK Electronic Technology Co., Limite
