Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
SJ101 Sintered Welding Flux Specification:GB/T 12470-2003�� ���������� F48A4-H08MnA; F55A4-H10Mn2 Equal to: AWS A5.17-97; AWS A5.23-97 F7A4-EH14; F8A4-EA2-A2 ����Description: SJ101 flux is a kind of fluorine-basic sin
Electronics Forum | Wed Jul 28 20:28:26 EDT 1999 | Carlos Palacios
Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into n
Electronics Forum | Fri Aug 16 17:08:07 EDT 2002 | davef
Could be. It does indicate imperfection. * �The component was manufactured and shipped correctly and should not need baking in order to use it.� => Sounds good. Most classes of MSD packaging have a self-life. Lots of times it�s expired before it
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Technical Library | 2013-08-13 09:49:53.0
One of the common issues I’ve noticed when visiting shops that use crimp force monitors (CFMs) is that the CFMs are usually turned off, regardless of the brand, because engineers and operators are not using them properly. Why, with all of their benefits, are CFMs not being used regularly by employees? One of the biggest problems is the lack of understanding of the variables affecting the CFM’s ability to detect variations. Crimp quality detection is similar to baking a cake. There are a lot of ingredients and if one ingredient is missing or of bad quality, you likely are not going to achieve your desired result. This article will go back through the basics of a crimp quality detection system and discuss what ingredients or variables you need to consider before switching off that CFM.
Technical Library | 2024-09-02 18:48:58.0
The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
from the solder before it solidifies. Process and design-related causes: • Improper solder volume due to improper land design • Improper solder volume due to blocked stencil aperture
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. More on PCB assembly can be found here. Steps Before Starting the PCB Fabrication Process Fabricating a printed circuit board is all about details
