New Equipment | Board Handling - Storage
Eureka XDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-2001 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, 1 M ω Ground Wire Capacity: 1314 L
New Equipment | Board Handling - Storage
Eureka Dry Tech XDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://www.eurekadrytech.com/fast-super-dryer/xdc-1001 Capacity: 657 Liters Humidity Range: LESS THAN 5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after acce
New Equipment | Board Handling - Storage
Eureka XDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-101 Capacity: 93 Liters Humidity Range: ≤5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after accessing door for 30 se
Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss
Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the
Electronics Forum | Thu Nov 01 17:36:20 EST 2001 | davef
We don�t bake between routine washing between soldering cycles. We bake when we immediately go to test or box-build. Certainly, it all depends on your process, materials, and boards. So, how did you determine that you needed to spend the money? I
Electronics Forum | Sat Aug 25 08:39:15 EDT 2007 | gsala
If plastic Carrier Tape (CT)/ emboss tape, is made by: a)Polycarbonate material, it can withstand temperature around 120C� or may be more mantaining original dimension. b)Polystirene material, at max 45�C-50C� the CT starts to change dimensions and
Electronics Forum | Sat Jul 27 09:39:46 EDT 2019 | davef
Doug: Please send me your email address by selecting the link below my avatar to the left
Electronics Forum | Thu Jul 25 08:58:22 EDT 2019 | Matt
Hey all, i'm hoping to get some feedback from the community on baking process versus a dry box. current process we have for rework of PCBs is to perform a 16 hour bake cycle on hardware before BGA rework is performed. however this process is ineffi
Electronics Forum | Mon Jul 29 16:52:51 EDT 2019 | stephendo
https://www.jedec.org/document_search?search_api_views_fulltext=j-std-033 You will have to register to download. It has the bake time charts. For BGAs at 40C we are talking days to weeks to months depending on thickness.
Electronics Forum | Wed Jan 22 15:50:23 EST 2003 | davef
Some people run underfill through their reflow oven set with a normal recipe, but at breakneck speed. We think that might not produce the cure that we'd like to obtain. We'd don't use our reflow oven because we don't want to given-up the time to
