Electronics Forum | Fri Jul 30 17:16:59 EDT 1999 | Dave F
| Hello Netters, | | I have a customer who wants us to aquaeos wash a PCB after all operations have been performed. The PWB is two layer FR4 with a Transformer, a Multichip Module with Conformal Coating, (6) 11" insulated wires that are tinned on e
Electronics Forum | Mon Nov 20 15:10:56 EST 2017 | bstogsdill
Aerospace/military application- we have recently installed an SMT line. Our prior cleaning of RMA flux was Isopropyl Alcohol only, but with the reflow oven on line, the flux is now baked on. I am looking into FLUX OFF cleaner for removal of t
Electronics Forum | Tue Oct 19 23:17:48 EDT 1999 | Stu Leech
I answered another post regarding the subject of demoisturizing bake-out. Our new process works for taped and reeled devices as well as those in trays. Stu Leech
Electronics Forum | Thu Oct 04 13:04:52 EDT 2001 | Hussman
Without seeing your X-ray, it sounds like your BGAs are out gassing. This casues the situation you described. Try baking some BGAs and run them along with ones not baked to see.
Electronics Forum | Mon Jun 28 09:15:21 EDT 2004 | jdumont
Morning all, we have been seeing some problems with the edges of some of our BGA's curling away from the PCB after reflow. Is this possibly a moisture problem? If so what would be a good time/temp to bake them at to rectify the problem? Thanks in
Electronics Forum | Mon Jul 28 06:28:04 EDT 2008 | cobar
Hi Debra.Baking must be above the evaporation temp of water.This leads to an oxidation problem on the components and affects solderability.Please follow the link and check out Totech on that page.http://www.shanelo.co.za/products.htm
Electronics Forum | Mon May 24 19:24:35 EDT 2010 | jry74
We bake all of our boards at 220 degrees F for two hours. This bakes out all the moisture. Blow off the parts prior to placing in the oven.
Electronics Forum | Thu Jul 01 11:48:10 EDT 2010 | mb_mfg
Sid, Try baking the boards before running, to insure no moisture. Baking out the moisture will help prevent warping. Should you need further assistance, we supply fixtures to force the board to stay flat to reduce to thermo shock during wave solde
Electronics Forum | Mon Dec 01 14:51:55 EST 2014 | jpal
We had the same problem too. Water would remain under the caps even after a bake out. We saw this numerous times when the caps were removed after the wash and bake. The only fix was to hand solder the large electrolytics.
Electronics Forum | Fri Feb 02 05:11:29 EST 2018 | deanm
I developed our company's procedure for moisture sensitive devices based on J-STD-033 and I don't recall anything requiring a certain ramp rate. Furthermore baking at 85C will greatly extend the time to reset the clock and it is harder to maintain
